Industrial / Electroplating
RJ45 SMT贴片镀锡 Tin-Plated Series
Model:RJ45 SMT贴片镀锡
RJ45 SMT tin-plated contact designed for surface-mount Ethernet connector assemblies, manufactured to eliminate haze, burn marks, exposed copper, and plating voids that could compromise signal integrity or solderability. Strict batch-level color uniformity ensures consistent performance across high-volume PCB production. Used in SMT RJ45 jacks for networking equipment, routers, switches, and embedded communication modules.
Key Features
- RJ45 SMT tin-plated contact engineered for surface-mount Ethernet connector assemblies
- Eliminates haze, burn marks, plating skip, and exposed copper on all plated surfaces
- Designed for automated reflow soldering with consistent coplanarity across contact array
- Same-batch color uniformity ensures visual consistency in high-density port arrays
- Tin plating provides reliable solderability for high-volume PCB assembly processes
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: RJ45
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
Tin-Plated Series Specifications
Service typeconnector terminal electroplating / selective plating
Connector familyRJ45
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、gold plating without haze、spots、black spots、burn marks、scratches、exposed Cu、plating skip；
B、色差no color difference allowed in same batch；
C、色泽no plating discoloration；
D、tin plating without haze、spots、scratches现象；
E、after plating,, Flat Pinno deformation；
2. Bonding Strengthtake a set of flat pins,bend toward smooth side90°restore after bending,every interval of2mmrepeat this bending action,再using3mmtape peel test on smooth side
(gold plating面)orat10x magnification inspection, no plating peeling is acceptable；
3. Flexibilityfrom smooth side to burr side of flat pin90°reciprocating bending2次, no break is acceptable；
Typical Applications
SMT RJ45 Ethernet jack contact arrays for networking equipment PCBs
Gigabit and Fast Ethernet switch and router port connector assemblies
Industrial Ethernet panel-mount connector surface-mount contacts
Network interface card (NIC) RJ45 connector contact manufacturing
PoE-capable RJ45 connector assemblies requiring reliable current-carrying contacts
Frequently Asked Questions
What makes this contact suitable for SMT RJ45 Ethernet connector assemblies?
The contact geometry is designed for surface-mount attachment with controlled coplanarity to ensure uniform solder joint formation across all eight positions. Tin plating provides excellent solderability with lead-free alloys, and strict cosmetic controls eliminate defects that could cause solder bridging or open joints during reflow.
Can this contact support Power over Ethernet (PoE) current requirements?
PoE (IEEE 802.3af) requires up to 350 mA per conductor pair, while PoE+ (802.3at) requires up to 600 mA. Contact current capacity depends on cross-section and plating. Please provide your PoE standard and thermal requirements to CZT engineering to confirm suitability and obtain derating data for your specific application.
How does CZT ensure batch-to-batch consistency for RJ45 contact color and plating?
CZT enforces a no-color-difference rule within each production batch and monitors plating bath parameters including tin concentration, temperature, and current density throughout the run. Incoming copper strip is also inspected to ensure substrate consistency, which directly affects plating appearance and adhesion uniformity.
Tin-Plated Series Details
CategoryIndustrial
SubcategoryElectroplating
Model NumberRJ45 SMT贴片镀锡
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.