Industrial / Electroplating
SFP端子3 SFP Connector Terminal Plating
Model:SFP端子3
The SFP Series (SFP端子3) is an electroplated SFP connector terminal component with gold and nickel plating applied to precise thickness specifications, engineered for the demanding contact performance requirements of SFP transceiver applications in telecommunications and data networking. The plating quality standards — including freedom from haze, spots, burn marks, and exposed copper — ensure low and stable contact resistance across the service life of SFP cage assemblies in enterprise switches, optical line terminals, and metro Ethernet platforms. Bonding strength is confirmed through 90-degree bend cycling and tape peel adhesion testing.
Key Features
- Gold and nickel electroplating applied to precision-stamped copper alloy terminal
- Nickel undercoat thickness controlled to prevent gold layer porosity
- Surface finish free of haze, spots, scratches, and exposed base metal
- Designed for reliable electrical performance across rated SFP insertion cycles
- Batch-level plating uniformity verified through XRF thickness measurement
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: SFP
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP Connector Terminal Plating Specifications
Service typeconnector terminal electroplating / selective plating
Connector familySFP
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、gold plating without haze、spots、black spots、burn marks、scratches、exposed Cu、plating skip；
B、色差no color difference allowed in same batch；
C、色泽no plating discoloration；
D、tin plating without haze、spots、scratches现象；
E、after plating,, Flat Pinno deformation；
2. Bonding Strengthtake a set of flat pins,bend toward smooth side90°restore after bending,every interval of2mmrepeat this bending action,再using3mmtape peel test on smooth side
(gold plating面)orat10x magnification inspection, no plating peeling is acceptable；
3. Flexibilityfrom smooth side to burr side of flat pin90°reciprocating bending2次, no break is acceptable；
Typical Applications
SFP connector terminal contacts requiring gold-over-nickel plating
High-reliability telecom and datacom SFP module assemblies
Connector terminals exposed to humid or mildly corrosive environments
OEM SFP connector production with nickel diffusion barrier requirements
Switch and router line cards with extended service life requirements
Frequently Asked Questions
Why is a nickel undercoat used beneath the gold plating on the SFP端子3?
Nickel acts as a diffusion barrier that prevents copper from migrating through the gold layer over time. Without it, copper oxidation at the surface would increase contact resistance and cause discoloration. The nickel layer also improves gold plating adhesion and overall wear resistance during mating cycles.
What nickel plating thickness is applied to this terminal?
Nickel undercoat thickness is typically 50 to 150 microinches, applied prior to gold plating. The exact specification is defined per customer drawing. Nickel thickness is verified by XRF measurement and reported in the plating inspection documentation provided with each production lot.
Is this terminal suitable for applications in humid or corrosive environments?
The gold-over-nickel plating system provides good resistance to humidity and mild corrosion, making it suitable for industrial and telecom environments. For harsh environment applications, CZT can recommend increased gold thickness or alternative plating configurations to meet specific environmental test requirements.
SFP Connector Terminal Plating Details
CategoryIndustrial
SubcategoryElectroplating
Model NumberSFP端子3
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.