Industrial / Electroplating
SFP端子4 SFP Connector Terminal Plating
Model:SFP端子4
The SFP Series (SFP端子4) is a precision electroplated SFP connector terminal with gold plating at 3U to 50 microinches and nickel underplating, designed to deliver consistent low contact resistance and corrosion resistance in SFP transceiver cage assemblies. Meeting strict appearance standards with no color variation within production batches and no plating discoloration, this terminal supports reliable electrical performance in SFP-based optical networking equipment including Gigabit Ethernet switches, SAN directors, and optical transport nodes. The validated bonding strength ensures plating durability through the full mechanical lifecycle of SFP module hot-plugging.
Key Features
- Gold plating at 3U to 50 microinches for application-matched contact durability
- Precision electroplating with controlled nickel barrier and gold thickness layers
- Zero-defect appearance standard: no haze, burn marks, exposed copper, or skip
- Tin plating on solder termination areas for PCB reflow process compatibility
- Wide gold thickness range supports both cost-optimized and high-cycle designs
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: SFP
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP Connector Terminal Plating Specifications
Service typeconnector terminal electroplating / selective plating
Connector familySFP
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、gold plating without haze、spots、black spots、burn marks、scratches、exposed Cu、plating skip；
B、色差no color difference allowed in same batch；
C、色泽no plating discoloration；
D、tin plating without haze、spots、scratches现象；
E、after plating,, Flat Pinno deformation；
2. Bonding Strengthtake a set of flat pins,bend toward smooth side90°restore after bending,every interval of2mmrepeat this bending action,再using3mmtape peel test on smooth side
(gold plating面)orat10x magnification inspection, no plating peeling is acceptable；
3. Flexibilityfrom smooth side to burr side of flat pin90°reciprocating bending2次, no break is acceptable；
Typical Applications
SFP connector terminals requiring specified gold plating thickness ranges
High-insertion-cycle SFP interfaces in test and measurement equipment
Cost-optimized SFP connector production with minimum gold at 3U
Premium SFP module assemblies requiring 50 microinch gold for longevity
Telecom and enterprise networking SFP cage connector manufacturing
Frequently Asked Questions
What gold plating thickness range is available for the SFP端子4?
Gold plating is available from 3U (approximately 3 microinches) up to 50 microinches over a nickel barrier layer. The appropriate thickness is selected based on required insertion cycle life, contact resistance targets, and cost constraints. CZT can advise on the optimal specification for your application.
How does gold plating thickness affect insertion cycle life?
Thicker gold plating provides greater wear resistance, extending the number of reliable insertion and withdrawal cycles before contact resistance degradation occurs. For applications requiring 500 or more cycles — such as test sockets or hot-swap equipment — higher gold thickness in the 30–50 microinch range is recommended.
Can CZT provide XRF plating thickness reports for each production lot?
Yes, XRF (X-ray fluorescence) thickness measurement reports are available for each production lot, covering both gold and nickel layer thicknesses at defined measurement points. Reports are provided as standard quality documentation and can be formatted to meet customer-specific incoming inspection requirements.
SFP Connector Terminal Plating Details
CategoryIndustrial
SubcategoryElectroplating
Model NumberSFP端子4
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.