Industrial / Heat Sinks
SRQ-YZ-02
The SRQ-YZ-02 heat sink features an optimized fin pitch that balances airflow resistance with heat transfer efficiency, making it effective across a range of operating conditions. The flat, machined base ensures reliable contact with component mounting surfaces. Designed for use in inverters, battery management systems, and industrial power modules.
Key Features
- Optimized fin pitch balances airflow resistance with convective heat transfer efficiency
- Engineered fin spacing reduces pressure drop while maintaining high surface area
- Suitable for both natural convection and low-velocity forced-air cooling systems
- Consistent extrusion tolerances ensure repeatable thermal performance across batches
- Compact profile compatible with standard industrial enclosure form factors
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-02 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Industrial power supplies where fan noise and airflow restriction must be minimized
Telecom rectifier modules requiring low-impedance airflow paths
Fanless embedded industrial computers with passive cooling requirements
Energy metering and power monitoring equipment in sealed enclosures
Low-noise medical-grade power conversion equipment
Frequently Asked Questions
How does optimized fin pitch improve system-level thermal performance?
Fin pitch directly affects the trade-off between surface area and airflow resistance. Too fine a pitch increases pressure drop and reduces airflow in natural convection systems; too coarse a pitch reduces surface area. The SRQ-YZ-02's optimized pitch is selected to maximize heat transfer coefficient across the expected airflow velocity range for industrial applications.
What airflow velocity is recommended for the SRQ-YZ-02 in forced-air applications?
The SRQ-YZ-02 fin geometry is optimized for airflow velocities in the 1–3 m/s range, typical of low-speed axial fans used in industrial enclosures. Higher velocities yield diminishing returns due to the turbulent flow regime, while velocities below 0.5 m/s approach natural convection performance levels.
Can the SRQ-YZ-02 be used in a fanless design for a 30W power supply?
Yes, depending on ambient temperature and enclosure airflow. At 30W dissipation with a 25°C ambient and adequate free-air circulation around the heat sink, the SRQ-YZ-02's optimized fin pitch supports natural convection cooling within typical industrial component temperature limits. Thermal simulation or bench testing is recommended to confirm margin.
SRQ-YZ-02 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.