Service typeconnector terminal electroplating / selective plating
Connector familyCustom connector or industrial hardware
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、no yellow spots、black spots、white spots、water stains、incomplete degreasing、plating skip etc.;
B、no plating scratches、abrasion;
C、no product overlap、deformation、pin misalignment etc.;
2. Bonding Strengthbend with needle-nose pliers, no plating peeling;
3. IR Reflowproduct afterIRoven test(265 °C±5)no deformation after、blistering、discoloration anomalies。(this item only applies to products withIRtest requirement products);
4. Solderabilityproduct after steam aging test(temp.:97 °C time:8H)after, select tin-plated area for soldering test(dip in flux then immerse in
锡炉3-5s, temp.245±5 °C), using10--30x magnification, allow continuousPinhole、non-wetting and solder shrinkage defects,
solder coverage of total tested area95%;