Industrial / Precision Die Casting
OSFP Structural Part 2
OSFP Structural Part 2 is a die-cast precision component that contributes to the mechanical assembly and thermal performance of OSFP optical transceiver modules. Manufactured to exacting tolerances, it ensures proper alignment and heat dissipation in high-port-density line cards. Applicable in hyperscale data center interconnects, core network switches, and high-speed optical transport systems.
Key Features
- Precision die-cast component optimized for OSFP module mechanical and thermal assembly
- Contributes to overall module rigidity and resistance to mechanical shock and vibration
- Thermal interface geometry designed to maximize contact with host cage heat spreader
- High-pressure die casting ensures consistent wall thickness and void-free structure
- Compatible with OSFP MSA Rev 1.0 and later mechanical assembly specifications
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: OSFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
OSFP Structural Part 2 Specifications
Product typeprecision die-cast structural component
Connector / hardware familyOSFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
OSFP 800G DR8 and FR8 optical transceiver assemblies
Active optical cable (AOC) OSFP module mechanical housing
Telecom and cloud router line card optical module integration
High-density co-packaged optics adjacent module assemblies
OEM transceiver manufacturing requiring thermal-optimized housings
Frequently Asked Questions
How does OSFP Structural Part 2 support thermal performance in high-power modules?
The part's geometry is designed to maximize thermal contact area with the host cage's heat sink interface. The die-cast alloy's thermal conductivity, combined with precise surface flatness, minimizes thermal resistance and supports power dissipation requirements exceeding 15W per OSFP module.
Can this component be customized for proprietary OSFP module designs?
Yes, CZT offers custom tooling and design modification services. Engineering teams can adjust wall thickness, mounting features, and thermal interface geometry to accommodate proprietary module designs while maintaining OSFP MSA external envelope compliance.
What quality control processes apply to this die-cast part?
Each production batch undergoes dimensional inspection using CMM equipment, visual inspection for surface defects, and X-ray or CT scanning for internal void detection on critical structural features. CZT maintains ISO 9001-aligned quality management processes.
OSFP Structural Part 2 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.