Industrial / Electroplating
SFP端子 SFP Connector Terminal Plating
Model:SFP端子
The SFP Series (SFP端子) is a standard SFP connector terminal component with precision electroplating applied to gold and tin contact surfaces, meeting rigorous quality standards for appearance, color consistency, and plating adhesion in SFP transceiver manufacturing. Gold plating is applied without haze, spots, burn marks, or exposed copper, while tin plating is free of surface defects, ensuring reliable electrical contact in SFP cage assemblies used in Gigabit Ethernet switches, optical line cards, and fiber channel storage networking equipment. The 90-degree bend and tape peel bonding strength tests confirm plating durability under repeated mechanical cycling.
Key Features
- Standard SFP connector terminal with dual gold and tin electroplating zones
- Gold plating on contact surfaces ensures stable low-resistance mating interface
- Tin plating on solder tails provides reliable PCB solderability
- Strict no-defect appearance standard: no exposed copper, haze, or plating skip
- Manufactured to SFP MSA terminal dimensional and electrical requirements
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: SFP
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP Connector Terminal Plating Specifications
Service typeconnector terminal electroplating / selective plating
Connector familySFP
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、gold plating without haze、spots、black spots、burn marks、scratches、exposed Cu、plating skip；
B、色差no color difference allowed in same batch；
C、色泽no plating discoloration；
D、tin plating without haze、spots、scratches现象；
E、after plating,, Flat Pinno deformation；
2. Bonding Strengthtake a set of flat pins,bend toward smooth side90°restore after bending,every interval of2mmrepeat this bending action,再using3mmtape peel test on smooth side
(gold plating面)orat10x magnification inspection, no plating peeling is acceptable；
3. Flexibilityfrom smooth side to burr side of flat pin90°reciprocating bending2次, no break is acceptable；
Typical Applications
Standard SFP connector assemblies for 1G optical transceivers
PCB-mount SFP cage connectors in networking switches
Fiber channel and SONET/SDH interface hardware
Enterprise and carrier-grade SFP module production
Replacement terminal supply for SFP connector repair and rework
Frequently Asked Questions
What is the typical gold plating thickness on the SFP standard terminal contact area?
Gold plating is typically applied at 3U to 30 microinches over a nickel undercoat, depending on the customer specification and target insertion cycle life. Thicker gold is available for applications requiring extended durability. XRF measurement reports are provided upon request.
How is solderability of the tin-plated solder tail verified?
Solderability is verified per IPC J-STD-002 or equivalent standards using wetting balance or dip-and-look testing. Tin plating is inspected for haze and surface defects that could impair solder wetting. Solderability test reports are available as part of the qualification documentation package.
What copper alloy substrate is used for the standard SFP terminal?
The terminal is stamped from a copper alloy with high conductivity and adequate spring properties to maintain consistent contact normal force over the rated insertion cycle life. Specific alloy designation is available on the material certification provided with each production lot.
SFP Connector Terminal Plating Details
CategoryIndustrial
SubcategoryElectroplating
Model NumberSFP端子
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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