Industrial / Electroplating
圆线 Gold Wire Series
Model:圆线
Round gold-plated wire produced to strict electroplating standards, featuring a uniform gold finish free from haze, spots, blackening, scratches, or peeling. Bonding strength is verified by a self-winding 360° wrap test with no micro-cracks permitted, and arc height is controlled so that a 30–40 cm length maintains a chord of ≥29.5 cm with arc height ≤2.5 cm. Used in precision connector contacts, semiconductor bonding applications, and high-reliability electronic assemblies.
Key Features
- Round gold-plated wire with uniform finish free from haze, spots, and blackening
- 360° self-winding bond strength test confirms no micro-cracks in plating
- Arc height ≤2.5 cm over 29.5 cm chord length ensures consistent wire straightness
- Solderability verified by immersion at 245±5°C for 3–5 seconds with bright surface result
- Strict appearance inspection at 10× magnification for surface defect rejection
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: Custom connector or industrial hardware
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
Gold Wire Series Specifications
Service typeconnector terminal electroplating / selective plating
Connector familyCustom connector or industrial hardware
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. Appearanceuniform gold color, no plating haze、spots、black spots、blackening、scratches、peeling、bending phenomena；
2. Bonding Strengthself360° winding test no micro-cracks；
3. Arc Heighttake30-40cmplace gold wire on specified drawing, measure its chord length≥29.5cm, arc height≤2.5cm；
4. Solderabilitytake woundOKsample immersed in solder pot(solder temperature245±5 °C), 3-5s after, at10x magnification inspection表面光亮,
solder coverage reaches95%or above, noPinhole、orange peel defects；
5. Resistancetake4cmAu wire, clamp both ends measure resistance must≤35mΩ；
6. Salt Spray Test (5% NaCl Solution)G / F-6u”pass24Htest 15-50u”pass48Htest。
Storage Temperature35°Cor below；
Typical Applications
Connector pin plating for high-reliability electronic assemblies
Precision wire bonding in semiconductor and IC packaging
Spring contact and probe tip manufacturing requiring consistent gold thickness
High-cycle connector contacts in aerospace and defense electronics
Medical device connector components requiring biocompatible gold surfaces
Frequently Asked Questions
How is bonding strength verified on the gold-plated round wire?
A 360° self-winding test is performed on each production lot. The wire is wound around a mandrel through a full rotation and then inspected under magnification. The absence of micro-cracks in the plating layer confirms adequate adhesion between the gold deposit and the base substrate.
What does the arc height specification control?
Arc height measures the residual curvature of the wire after spooling. A chord length ≥29.5 cm with arc height ≤2.5 cm ensures the wire is sufficiently straight for automated feeding and termination equipment. Excessive curvature causes misfeeds and inconsistent crimp or bond results in high-speed assembly.
What solderability standard is used for acceptance?
A wound sample is immersed in a solder pot at 245±5°C for 3 to 5 seconds. After removal, the surface is inspected at 10× magnification. Acceptance requires a bright, continuous solder coating with no dewetting, voids, or dull areas, confirming the gold plating is free of contamination that would inhibit solder wetting.
Gold Wire Series Details
CategoryIndustrial
SubcategoryElectroplating
Model Number圆线
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.