Industrial / Precision Die Casting
QSFP Structural Part 3
QSFP Structural Part 3 is a precision die-cast component used in the mechanical assembly of Quad Small Form Factor Pluggable transceiver modules for high-speed networking applications. Its accurate die-cast geometry supports reliable module fitment and EMI containment in dense port configurations. Widely used in 40G, 100G, and 400G network switches, routers, and data center interconnect hardware.
Key Features
- Precision die-cast component for QSFP module mechanical assembly and housing integrity
- Engineered to QSFP MSA mechanical envelope for cage and bail latch compatibility
- Alloy construction delivers EMI shielding effectiveness in dense port configurations
- Dimensional stability maintained across operating temperature range of -40°C to +85°C
- Supports QSFP28 and QSFP+ module form factor mechanical requirements
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: QSFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
QSFP Structural Part 3 Specifications
Product typeprecision die-cast structural component
Connector / hardware familyQSFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
QSFP28 100G optical and DAC transceiver module assemblies
Data center ToR switch 100G port optical module production
QSFP+ 40G active optical cable mechanical housing manufacturing
Enterprise core switch high-density optical interconnect modules
OEM networking hardware QSFP module component supply
Frequently Asked Questions
Is QSFP Structural Part 3 compatible with both QSFP+ and QSFP28 assemblies?
Yes, the part is dimensioned to the QSFP MSA mechanical specification, which defines a common form factor shared by QSFP+, QSFP28, and QSFP-DD predecessor modules. Compatibility with specific module variants should be confirmed against your assembly drawings.
What alloy is used and what are its mechanical properties?
The component is typically cast from zinc alloy (e.g., Zamak series) or aluminum alloy, offering tensile strength in the range of 280–320 MPa, good thermal conductivity, and excellent castability for complex geometries required by QSFP housing designs.
What is the typical lead time for volume orders of QSFP Structural Part 3?
For established tooling, standard production lead times range from 4 to 6 weeks depending on order volume and surface finish requirements. Expedited schedules may be available. Contact CZT sales for a formal quotation and delivery commitment.
QSFP Structural Part 3 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.