Industrial / Precision Die Casting
QSFP Structural Part 4
QSFP structural part manufactured via precision die casting, designed to provide robust mechanical housing and EMI shielding for QSFP transceiver modules. Produced from high-grade zinc or aluminum alloy with tight dimensional tolerances to ensure reliable module retention and thermal dissipation. Commonly used in high-density 40G/100G optical networking equipment, data center switches, and telecom infrastructure.
Key Features
- Precision die-cast QSFP housing with integrated EMI shielding geometry
- Robust mechanical structure supports minimum 200-cycle mating durability
- Tight casting tolerances ensure consistent bail latch and cage engagement
- Alloy composition selected for optimal balance of weight and structural rigidity
- Compatible with QSFP MSA Rev 2.0 mechanical assembly requirements
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: QSFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
QSFP Structural Part 4 Specifications
Product typeprecision die-cast structural component
Connector / hardware familyQSFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
100G QSFP28 SR4 and LR4 optical transceiver manufacturing
High-density switch linecard QSFP module mechanical assembly
Wireless base station fronthaul optical module production
Campus and metro network QSFP optical interconnect modules
OEM transceiver brands requiring reliable die-cast housing supply
Frequently Asked Questions
How does the EMI shielding design of QSFP Structural Part 4 work?
The die-cast alloy housing forms a continuous conductive enclosure around the module's PCB and optical engine. Combined with conductive gaskets or finger stock at the cage interface, it attenuates radiated emissions and provides immunity to external electromagnetic interference, supporting FCC and CE compliance.
Can CZT provide QSFP Structural Part 4 with custom branding or markings?
Yes, CZT can incorporate customer logos, part numbers, or regulatory markings directly into the die-cast tooling or via post-process laser engraving and pad printing, supporting OEM branding requirements without additional assembly steps.
What surface treatments are available for corrosion protection?
Available treatments include electroless nickel plating, tin plating, chromate conversion coating, and anodizing (for aluminum alloys). Selection depends on the operating environment, contact requirements, and customer specification. CZT can advise on the most suitable option for your application.
QSFP Structural Part 4 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.