Industrial / Precision Die Casting
QSFP Structural Part 6
QSFP structural part produced through precision die casting, offering excellent rigidity and dimensional stability for transceiver module enclosures. The casting process ensures repeatable geometry and tight tolerances critical for proper QSFP cage alignment and EMI containment. Widely applied in 40G/100G/400G networking hardware, including line cards and chassis-based switching platforms.
Key Features
- Precision die-cast QSFP structural component with excellent rigidity and dimensional stability
- Low warpage alloy formulation maintains flatness across thermal cycling conditions
- Designed for compatibility with standard QSFP cage and heat sink assemblies
- Smooth internal surfaces minimize interference with optical sub-assembly insertion
- Supports high-volume OEM transceiver production with consistent quality output
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: QSFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
QSFP Structural Part 6 Specifications
Product typeprecision die-cast structural component
Connector / hardware familyQSFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
QSFP28 100G ER4 long-reach optical transceiver assemblies
Coherent QSFP module mechanical housing for telecom applications
Data center interconnect optical module OEM manufacturing
High-reliability QSFP module production for carrier-grade equipment
Network equipment manufacturer (NEM) optical module supply chains
Frequently Asked Questions
What dimensional stability can be expected from QSFP Structural Part 6 over temperature?
The die-cast alloy is selected for low coefficient of thermal expansion (CTE), typically 20–24 ppm/°C for zinc alloys. This ensures that critical mating dimensions remain within QSFP MSA tolerances across the standard operating temperature range of -40°C to +85°C.
How does CZT handle tooling maintenance to preserve dimensional accuracy over time?
CZT performs scheduled preventive maintenance on all production tooling, including cavity polishing, insert replacement, and dimensional verification against master gauges. Tool life and maintenance intervals are tracked per part number to ensure consistent quality throughout the product lifecycle.
Is QSFP Structural Part 6 suitable for use in carrier-grade telecom equipment?
Yes, the part's dimensional stability, alloy durability, and available surface treatments make it suitable for carrier-grade applications requiring compliance with Telcordia GR-468 or similar reliability standards. CZT can provide material certifications and test data to support qualification.
QSFP Structural Part 6 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.