Industrial / Heat Sinks
SRQ-XJ-28
The SRQ-XJ-28 heat sink delivers effective passive cooling for power electronics operating under sustained thermal loads. The fin structure is optimized to maximize heat dissipation within a minimal footprint. Designed for use in HVAC control units, industrial sensors, and compact power conversion modules.
Key Features
- Passive cooling design eliminates fan noise and mechanical failure risk
- Optimized fin geometry maximizes surface area for sustained heat dissipation
- Aluminum alloy construction ensures lightweight yet high thermal conductivity
- Compatible with standard PCB mounting and direct device attachment
- Rated for continuous operation under sustained high thermal load conditions
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-28 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling IGBTs and MOSFETs in industrial power converters
Thermal management for DC-DC converter modules
Heat dissipation in motor drive control boards
Passive cooling of rectifier bridges in power supplies
Industrial UPS systems requiring silent thermal management
Frequently Asked Questions
What thermal resistance can the SRQ-XJ-28 achieve under natural convection?
The SRQ-XJ-28 is engineered for low thermal resistance under passive convection conditions. For precise Rth values, consult the product datasheet or contact CZT engineering, as performance depends on mounting orientation, ambient temperature, and the thermal interface material used.
Is the SRQ-XJ-28 compatible with TO-220 and TO-247 package devices?
Yes, the SRQ-XJ-28 supports standard power semiconductor packages including TO-220 and TO-247. Mounting holes and contact surfaces are dimensioned to accommodate these common footprints, enabling direct attachment without custom brackets in most industrial PCB layouts.
What thermal interface material is recommended for the SRQ-XJ-28?
CZT recommends using a high-conductivity thermal pad or thermal grease with a conductivity of at least 1.5 W/m·K between the device and heat sink. This minimizes contact resistance and ensures rated thermal performance under sustained load conditions.
SRQ-XJ-28 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.