Industrial / Heat Sinks
SRQ-XJ-31
The SRQ-XJ-31 is a fin-type heat sink designed to cool power semiconductors and voltage regulators in industrial assemblies. The extruded profile allows straightforward integration into standard DIN-rail or panel-mount enclosures. Frequently used in programmable controllers, industrial communication gateways, and power distribution modules.
Key Features
- Fin-type profile engineered specifically for power semiconductor cooling
- Optimized fin pitch balances airflow resistance and heat transfer area
- Direct mounting surface machined flat for minimal contact thermal resistance
- Compatible with TO-220, TO-218, and D2PAK package footprints
- Suitable for both board-level and chassis-mount installation configurations
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-31 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling voltage regulators in industrial power distribution boards
Thermal management of power MOSFETs in switching converters
Heat dissipation for TO-package thyristors in motor controllers
Fin-cooled heatsinking for linear regulators in instrumentation
Industrial PCB assemblies with high-density power semiconductor layouts
Frequently Asked Questions
Which semiconductor package types is the SRQ-XJ-31 designed to support?
The SRQ-XJ-31 is dimensioned for common through-hole and surface-mount power packages including TO-220, TO-218, and D2PAK. The flat mounting base and pre-drilled fixing holes align with standard package tab dimensions, enabling secure attachment without custom hardware.
How should fin orientation be aligned relative to airflow direction?
For optimal performance, fins should be aligned parallel to the primary airflow direction. In natural convection setups, vertical fin orientation is preferred to leverage buoyancy-driven flow. In forced-air systems, align fins with the fan airstream to minimize flow resistance and maximize heat transfer.
Can multiple SRQ-XJ-31 units be mounted in close proximity on a PCB?
Yes, but thermal interaction between adjacent units should be considered during layout. Maintain adequate spacing to prevent recirculation of heated air between heat sinks. CZT recommends a minimum gap of 15–20 mm between units in passive convection configurations to preserve individual thermal performance.
SRQ-XJ-31 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.