Industrial / Heat Sinks
SRQ-XJ-33
The SRQ-XJ-33 is an industrial heat sink offering efficient passive cooling for power electronics in thermally challenging environments. Its aluminum construction supports anodizing or other surface treatments for enhanced corrosion resistance. Typical use cases include industrial inverters, smart grid equipment, and high-power PCB assemblies.
Key Features
- Efficient passive cooling optimized for thermally challenging industrial environments
- High fin count design increases convective surface area per unit volume
- Aluminum extrusion profile maintains dimensional consistency across production batches
- Low thermal resistance base ensures effective heat spreading from device contact
- Compatible with clip-mount and screw-mount power semiconductor attachment methods
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-33 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Passive cooling in high-ambient-temperature industrial control cabinets
Thermal management for power electronics in foundry or kiln environments
Heat dissipation in sealed enclosures with limited airflow
Cooling of power semiconductors in high-duty-cycle switching applications
Industrial drives operating in thermally demanding process environments
Frequently Asked Questions
How does the SRQ-XJ-33 perform in high ambient temperature environments?
The SRQ-XJ-33 is designed to maintain effective thermal dissipation even when ambient temperatures are elevated. Its high fin density maximizes convective area, reducing junction-to-ambient thermal resistance. For environments above 60°C ambient, CZT recommends a detailed thermal simulation to confirm adequate derating margins.
Can the SRQ-XJ-33 be used inside sealed enclosures without airflow?
In sealed enclosures, the SRQ-XJ-33 relies on radiation and limited internal convection. Performance will be reduced compared to open-air installations. For sealed deployments, CZT recommends calculating the enclosure's effective thermal resistance and ensuring total power dissipation stays within safe limits for the target junction temperature.
What attachment methods are supported for power devices on the SRQ-XJ-33?
The SRQ-XJ-33 supports both screw-mount and spring-clip attachment for standard power semiconductor packages. The flat, machined base surface accommodates thermal pads or grease for either method. Screw mounting is preferred for high-vibration environments to ensure consistent long-term contact pressure.
SRQ-XJ-33 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.