Industrial / Heat Sinks
SRQ-XJ-34
The SRQ-XJ-34 is an industrial-grade heat sink designed for efficient thermal dissipation in high-density electronic assemblies. Its extruded aluminum construction provides a reliable thermal path for components operating under sustained load. Suitable for power modules, motor drives, and industrial control equipment.
Key Features
- Industrial-grade design optimized for high-density electronic assembly cooling
- Compact footprint enables deployment in space-constrained PCB layouts
- Extruded aluminum fin array provides high thermal dissipation per unit area
- Anodized finish enhances radiative heat transfer and surface durability
- Standardized mounting pattern supports rapid integration into existing designs
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-34 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Thermal management in high-density power converter PCB assemblies
Cooling of closely spaced power semiconductors in multi-rail supplies
Heat dissipation in compact industrial embedded computing platforms
Thermal solution for high-density servo drive control boards
Space-constrained industrial IoT gateway power management modules
Frequently Asked Questions
How does the SRQ-XJ-34 manage thermal performance in high-density assemblies?
The SRQ-XJ-34 uses a high-fin-density extrusion profile to maximize surface area within a compact footprint. In high-density assemblies, careful attention to airflow path planning is essential. CZT recommends ensuring fin channels are not obstructed by adjacent components to maintain rated convective performance.
Is the SRQ-XJ-34 suitable for automated PCB assembly processes?
Yes. The SRQ-XJ-34 features a standardized mounting footprint compatible with automated pick-and-place and screw-fastening processes. Its consistent dimensional tolerances across production batches ensure reliable fit in high-volume manufacturing environments without manual adjustment.
What is the base thickness of the SRQ-XJ-34, and does it affect thermal spreading?
The SRQ-XJ-34 base is designed with sufficient thickness to provide effective lateral heat spreading from the device contact area to the fin array. This minimizes hot spots at the device interface. For exact base dimensions, refer to the product drawing available from CZT.
SRQ-XJ-34 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.