Industrial / Heat Sinks
SRQ-XJ-35
The SRQ-XJ-35 heat sink offers a compact fin array profile optimized for natural or forced-air convection cooling. Manufactured from thermally conductive aluminum alloy, it maintains component temperatures within safe operating limits. Commonly used in switching power supplies, inverters, and embedded computing platforms.
Key Features
- Compact fin array profile optimized for natural and forced-air convection
- Low-profile design suitable for height-restricted electronic enclosures
- Uniform fin spacing minimizes pressure drop in forced-air cooling systems
- High-conductivity aluminum alloy base reduces device-to-sink thermal resistance
- Versatile mounting compatible with standard TO-package and SMD power devices
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-35 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling power semiconductors in low-profile industrial power supplies
Thermal management in height-restricted DIN rail mounted controllers
Heat dissipation for compact motor drive modules
Forced-air cooling of power electronics in 1U rack equipment
Natural convection cooling in slim-form industrial automation panels
Frequently Asked Questions
What is the minimum airflow velocity required to achieve rated performance on the SRQ-XJ-35?
The SRQ-XJ-35 is effective under natural convection but achieves significantly lower thermal resistance with forced airflow starting at approximately 1 m/s. For precise Rth vs. airflow velocity curves, request the thermal characterization data from CZT's technical team.
Is the SRQ-XJ-35 compatible with SMD power packages such as D2PAK?
Yes, the SRQ-XJ-35 mounting surface is compatible with D2PAK and similar SMD power packages when used with appropriate thermal interface materials. For through-hole TO-220 and TO-247 packages, standard screw or clip mounting is supported using the provided fixing points.
Can the SRQ-XJ-35 be used in 1U rack-mount server or industrial computing applications?
Yes. The compact, low-profile fin array of the SRQ-XJ-35 is well-suited for 1U enclosures where vertical clearance is limited. In these applications, it typically operates with forced airflow from system fans, which substantially improves thermal resistance compared to passive operation.
SRQ-XJ-35 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.