Industrial / Heat Sinks
SRQ-XJ-36
The SRQ-XJ-36 is a passive heat sink featuring a high-fin-density design that maximizes surface area within a constrained footprint. Its anodized finish improves emissivity and corrosion resistance for long-term reliability. Well suited for PLCs, servo amplifiers, and industrial automation enclosures.
Key Features
- High-fin-density design maximizes convective surface area in constrained footprint
- Passive operation with no moving parts for maintenance-free thermal management
- Precision-extruded aluminum fins ensure consistent inter-fin spacing and airflow
- Optimized fin height-to-pitch ratio balances thermal resistance and pressure drop
- Suitable for both vertical and horizontal mounting orientations
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-36 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-density power module cooling in compact industrial converters
Thermal management for multi-device power stages in tight PCB layouts
Passive cooling of power electronics in sealed or semi-sealed enclosures
Heat dissipation in space-constrained embedded industrial controllers
Cooling of high-power LED driver modules in industrial lighting systems
Frequently Asked Questions
How does high fin density affect airflow resistance in the SRQ-XJ-36?
Higher fin density increases convective surface area but also raises airflow resistance through the fin channels. The SRQ-XJ-36 fin pitch is optimized to balance these factors for natural convection use. In forced-air applications, ensure fan static pressure is sufficient to maintain adequate flow through the dense fin array.
What is the benefit of the SRQ-XJ-36 compared to standard lower-fin-density heat sinks?
The SRQ-XJ-36 delivers lower thermal resistance per unit footprint area compared to standard fin-count designs. This makes it the preferred choice when board real estate is limited but power dissipation requirements are high, allowing engineers to meet thermal targets without increasing the heat sink footprint.
Is the SRQ-XJ-36 suitable for use in sealed enclosures relying on radiation?
In sealed enclosures, the high fin density of the SRQ-XJ-36 provides increased radiative surface area, which can improve passive performance compared to low-fin-count alternatives. However, convective gains are limited without airflow. CZT recommends a full thermal analysis for sealed deployments to confirm adequate margins.
SRQ-XJ-36 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.