Industrial / Heat Sinks
SRQ-XJ-37
The SRQ-XJ-37 heat sink is engineered for direct mounting onto power semiconductors and TO-package devices requiring consistent thermal management. The flat base ensures low contact resistance when used with thermal interface materials. Typical applications include rectifier assemblies, IGBT modules, and solid-state relays.
Key Features
- Engineered for direct mounting onto TO-package power semiconductor devices
- Flat lapped base surface minimizes contact thermal resistance at device interface
- Compact profile designed for board-level integration without chassis attachment
- Supports TO-220, TO-218, TO-247, and TO-3P package mounting configurations
- Lightweight aluminum construction reduces mechanical stress on PCB pads and leads
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-37 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Direct TO-220 heatsinking on industrial power supply PCBs
Cooling TO-247 IGBTs in compact motor drive assemblies
Board-level thermal management for TO-3P power transistors
Heat dissipation for TO-package linear regulators in instrumentation
Thermal management of TO-218 rectifier devices in welding equipment
Frequently Asked Questions
Which TO-package types is the SRQ-XJ-37 designed to mount directly onto?
The SRQ-XJ-37 is designed for direct mounting on TO-220, TO-218, TO-247, and TO-3P packages. Mounting hole positions and base contact dimensions are aligned with the tab geometry of these standard packages, enabling secure attachment using M3 screws with or without isolation hardware.
Should an isolation pad be used between the device and the SRQ-XJ-37?
If the device tab is electrically live and the heat sink is grounded or shared between multiple devices, an isolation pad such as a mica or silicone thermal pad is required. Always verify the electrical isolation requirement for your circuit before deciding whether to use an insulating interface material.
What torque should be applied when mounting a TO-package device to the SRQ-XJ-37?
CZT recommends following the semiconductor manufacturer's specified mounting torque for the device package, typically 0.5–0.6 N·m for M3 screws on TO-220 and similar packages. Over-torquing can warp the device tab or heat sink base, increasing contact thermal resistance and risking device damage.
SRQ-XJ-37 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.