Industrial / Heat Sinks
SRQ-XJ-40
The SRQ-XJ-40 is a low-profile heat sink suited for applications where vertical clearance is limited but effective cooling is still required. Its closely spaced fins are optimized for forced-air cooling scenarios with directed airflow. Frequently specified in rack-mounted electronics, telecom equipment, and compact drive controllers.
Key Features
- Low-profile form factor designed for height-restricted PCB and chassis layouts
- Wide base footprint distributes heat evenly across multiple device mounting points
- Shallow fin array maintains effective cooling within tight vertical clearance
- Lightweight aluminum extrusion minimizes added weight in portable equipment
- Flat machined base ensures reliable thermal contact with surface-mount power devices
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-40 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Low-profile industrial controllers installed in shallow DIN-rail enclosures
Flat-panel power electronics with strict height limitations
Embedded computing modules requiring sub-20mm cooling solutions
Telecom shelf units with limited inter-board spacing
Compact motor controllers in robotics and automation joints
Frequently Asked Questions
What is the typical height profile of the SRQ-XJ-40?
The SRQ-XJ-40 is engineered for low-profile applications, with an overall height designed to fit within tight vertical clearances common in 1U or 2U enclosures. Exact dimensions should be confirmed against your mechanical envelope, but the design prioritizes sub-25mm total height.
Can the SRQ-XJ-40 cool multiple devices simultaneously?
Yes. The wide base footprint allows multiple TO-220 or similar packages to be mounted in a row along the base. Thermal spreading within the aluminum base helps distribute heat across the fin array, though total power dissipation limits must be observed.
Is forced airflow necessary for the SRQ-XJ-40?
For low to moderate power loads, natural convection is sufficient. However, due to the reduced fin height limiting convective surface area, forced airflow is recommended when dissipating more than 20W to maintain junction temperatures within safe operating limits.
SRQ-XJ-40 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
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