Industrial / Heat Sinks
SRQ-XJ-41
The SRQ-XJ-41 heat sink features a symmetrical fin layout that delivers uniform heat spreading across the base, reducing localized hot spots on sensitive components. Constructed from high-purity aluminum alloy for consistent thermal conductivity. Designed for use in motor controllers, power converters, and industrial test equipment.
Key Features
- Symmetrical fin layout ensures uniform lateral heat spreading across the base
- Balanced thermal resistance profile reduces localized hot spots under offset loads
- Precision-extruded aluminum profile maintains consistent fin pitch and thickness
- Center-mount or edge-mount device placement both supported by symmetric design
- Suitable for multi-device arrays requiring even temperature distribution
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-41 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Multi-MOSFET power stages requiring balanced junction temperature management
Dual-output DC-DC converters with symmetrically placed switching devices
Industrial LED driver modules with distributed thermal load
Redundant power supply units with paired power transistors
Signal conditioning boards with multiple linear regulators
Frequently Asked Questions
Why is a symmetrical fin layout important for multi-device cooling?
A symmetrical fin layout ensures that heat generated by multiple devices mounted at different positions along the base spreads evenly through the aluminum. This prevents one device from running hotter than another due to uneven thermal resistance paths, which is critical for balanced performance and reliability in multi-device assemblies.
How does the SRQ-XJ-41 reduce thermal hot spots?
The uniform fin pitch and symmetric base geometry create equal thermal resistance from any mounting point to the fin tips. Combined with the high thermal conductivity of the aluminum alloy, this minimizes temperature gradients across the base, reducing peak junction temperatures even under asymmetric load conditions.
Is the SRQ-XJ-41 compatible with clip-mount or screw-mount device attachment?
Yes. The base is designed to accommodate both spring-clip and screw-mount attachment methods for standard power packages. Screw mounting is recommended for high-vibration environments to ensure consistent contact pressure and long-term thermal interface integrity.
SRQ-XJ-41 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.