Industrial / Heat Sinks
SRQ-YZ-09
The SRQ-YZ-09 heat sink delivers consistent passive cooling for medium-power electronic assemblies through its multi-fin aluminum extrusion. The uniform fin spacing supports both natural and forced-air convection depending on system requirements. Ideal for use in industrial PCs, frequency converters, and power distribution units.
Key Features
- Multi-fin passive design delivers consistent cooling for medium-power assemblies
- Uniform fin pitch optimized for natural convection in still-air environments
- Aluminum extrusion provides repeatable thermal resistance across production batches
- Base plate designed for full contact with standard power package footprints
- Suitable for 24/7 continuous operation in industrial electronic assemblies
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-09 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Passive cooling for medium-power industrial DC-DC converter modules
Thermal management in industrial programmable logic controller power stages
Heat dissipation for gate driver circuits in motor control systems
Cooling power semiconductors in industrial battery management systems
Thermal regulation in medium-power industrial lighting control drivers
Frequently Asked Questions
What power range is the SRQ-YZ-09 designed to handle?
The SRQ-YZ-09 is optimized for medium-power electronic assemblies, typically handling component heat loads in the range suitable for passive convection cooling. It is designed for applications where active cooling is undesirable but thermal loads exceed what minimal heat sinks can manage.
How consistent is the SRQ-YZ-09's thermal performance across units?
The SRQ-YZ-09 is manufactured via aluminum extrusion, a process that delivers highly consistent fin geometry and base thickness across production batches. This ensures repeatable thermal resistance values, which is critical for industrial designs requiring predictable thermal budgets.
Can the SRQ-YZ-09 be used in sealed industrial enclosures?
Yes. The SRQ-YZ-09's passive multi-fin design is suitable for sealed enclosures where natural convection is limited. However, thermal performance will be reduced in fully sealed environments. For sealed applications, ensure the enclosure's internal thermal budget accommodates the reduced convection efficiency.
SRQ-YZ-09 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
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