Industrial / Heat Sinks
SRQ-YZ-17
The SRQ-YZ-17 heat sink features a dense fin configuration that increases convective surface area for improved heat dissipation in forced-air cooling setups. Its precision-extruded aluminum body ensures consistent dimensional tolerances for repeatable assembly. Designed for use in server power supplies, industrial automation panels, and high-frequency converters.
Key Features
- Dense fin configuration maximizes convective surface area per unit volume
- Thin-fin extrusion increases fin count for superior heat dissipation density
- Optimized fin spacing prevents boundary layer merging for efficient airflow
- Suitable for both natural convection and low-velocity forced-air cooling
- Precision base flatness ensures minimal thermal interface resistance
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-17 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-density power module cooling in compact industrial inverters
Thermal management for multi-channel motor driver PCBs
Heat dissipation in densely packed server power supply units
Cooling high-frequency switching transistors in telecom rectifiers
Passive heat management for power amplifier stages in industrial RF equipment
Frequently Asked Questions
What is the advantage of a dense fin configuration in the SRQ-YZ-17?
A dense fin configuration increases total convective surface area within a compact footprint, lowering thermal resistance. This allows the SRQ-YZ-17 to dissipate more heat per unit size compared to standard fin profiles, making it ideal for space-constrained high-power applications.
Does the SRQ-YZ-17 require forced airflow to operate effectively?
No, the SRQ-YZ-17 is designed to function under natural convection. However, its dense fin geometry responds particularly well to forced airflow. Even modest fan-assisted cooling significantly reduces thermal resistance, making it versatile for both passive and active cooling system designs.
How should I select fin spacing for my application when using the SRQ-YZ-17?
Fin spacing selection depends on airflow velocity and allowable pressure drop. For natural convection, wider spacing (3–5mm) prevents boundary layer interference. For forced air, tighter spacing increases surface area utilization. Contact CZT with your airflow and power data for application-specific guidance.
SRQ-YZ-17 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.