Industrial / Heat Sinks
SRQ-CC-13 Heat Sink
Model:SRQ-CC-13
The SRQ-CC-13 is a high-performance heat sink designed for thermal management of optical transceiver modules and power electronics in high-speed networking and industrial applications. Featuring an extended fin array for maximum surface area, this heat sink is optimized for active cooling environments where high-power optical modules or switch ASICs require aggressive heat dissipation to maintain reliable operation. Its aluminum alloy construction and precision-machined mounting surface ensure optimal thermal contact and long-term performance stability in 24/7 data center and carrier network equipment.
Key Features
- High-performance thermal design targets optical transceiver and power electronics applications
- Enhanced fin density increases effective heat transfer area for higher TDP components
- Robust aluminum construction withstands mechanical vibration in industrial deployments
- Optimized airflow channeling reduces pressure drop across the fin array
- Surface finish compatible with both adhesive mounting and mechanical clip retention
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-CC-13 Heat Sink Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-TDP optical transceiver cooling in core networking equipment
Power electronics thermal management in industrial power conversion systems
High-density switch ASIC cooling in data center fabric infrastructure
Telecom base station equipment requiring high-reliability thermal solutions
Industrial automation controllers with elevated heat dissipation requirements
Frequently Asked Questions
What distinguishes the SRQ-CC-13 from standard heat sink designs?
The SRQ-CC-13 features an enhanced fin density and optimized airflow channeling geometry that reduces thermal resistance compared to conventional extruded heat sinks. This makes it suitable for higher TDP optical and power electronics components where standard designs would result in excessive junction temperatures.
Is the SRQ-CC-13 compatible with clip-on retention systems?
Yes. The SRQ-CC-13 base is designed to accommodate standard spring clip and push-pin retention mechanisms, enabling tool-free installation in production environments. Custom retention hardware can be specified for OEM applications requiring specific contact force profiles.
What is the expected service life of the SRQ-CC-13 in continuous operation?
The SRQ-CC-13 is manufactured from anodized aluminum with no moving parts, providing a service life consistent with the host system. Under normal operating conditions within rated temperature and humidity ranges, degradation of thermal performance over time is negligible.
SRQ-CC-13 Heat Sink Details
CategoryIndustrial
SubcategoryHeat Sinks
Model NumberSRQ-CC-13
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.