Industrial / Heat Sinks
SRQ-HJ-03
The SRQ-HJ-03 is a compact, high-efficiency heat sink designed for thermal management in space-constrained optical networking and connector applications. Its advanced fin construction and low-profile design accommodate the tight clearance requirements of high-density switch line cards and blade server modules while providing sufficient thermal dissipation for SFP+ and QSFP-28 transceiver modules operating at full data rate. The heat sink's aluminum alloy construction and optimized fin geometry deliver effective thermal resistance suitable for forced-air-cooled equipment in standard data center environments and industrial networking platforms requiring compact thermal solutions.
Key Features
- Compact low-profile design optimized for space-constrained optical networking equipment
- High surface-area-to-volume ratio fin array maximizes convective heat transfer
- Designed for direct integration with standard optical transceiver cage assemblies
- Lightweight aluminum construction minimizes added board-level mechanical stress
- Suitable for both forced-air and passive cooling configurations
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-03 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Space-constrained 1U and 2U rack-mount switch thermal management
Edge computing optical module cooling in compact enclosures
High-density SFP28 and QSFP28 port thermal regulation
Embedded networking hardware with limited airflow clearance
Compact industrial gateway optical interface heat dissipation
Frequently Asked Questions
How does the SRQ-HJ-03 perform in low-airflow environments?
The SRQ-HJ-03 is designed with a high-density fin array that performs efficiently in both forced-air and passive cooling scenarios. In low-airflow environments, its optimized fin pitch reduces flow resistance while maintaining adequate heat dissipation for typical optical module TDP ranges.
Is the SRQ-HJ-03 suitable for 1U rack-mount applications?
Yes. The SRQ-HJ-03's low-profile form factor is specifically suited for 1U and 2U rack-mount equipment where vertical clearance is limited. Its compact height ensures compatibility with standard chassis designs without interfering with adjacent components or airflow baffles.
Can the SRQ-HJ-03 be used with thermal interface pads?
Yes. The SRQ-HJ-03's contact surface is compatible with standard thermal interface materials including phase-change pads and graphite sheets. Using a high-conductivity TIM is recommended to minimize contact resistance and achieve rated thermal performance across the module interface.
SRQ-HJ-03 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.