Industrial / Heat Sinks
SRQ-HJ-07
The SRQ-HJ-07 is a high-performance heat sink engineered for thermal management of optical transceiver modules and high-speed connector assemblies in data center and telecommunications infrastructure. Designed with an advanced fin construction optimized for the airflow characteristics of high-density switch chassis, this heat sink provides effective cooling for SFP+, QSFP-28, and QSFP-DD modules in multi-port line card configurations. Its robust construction and standardized mounting interface ensure reliable thermal contact and long-term performance stability in mission-critical networking environments operating at full port density in enterprise and carrier-grade data center deployments.
Key Features
- High-performance fin structure delivers superior thermal dissipation for optical transceivers
- Compatible with QSFP-DD, OSFP, and high-power SFP form factor cage assemblies
- Precision base flatness reduces thermal interface resistance at module contact surface
- Anodized surface treatment enhances thermal emissivity and corrosion resistance
- Designed for integration in both 1U forced-air and open-frame passive cooling systems
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-07 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-speed optical transceiver cooling in hyperscale data centers
400G coherent module thermal management in DWDM systems
Network switch ASIC heat dissipation in high-density chassis
Optical amplifier module thermal regulation in telecom equipment
High-power pluggable module cooling in open networking platforms
Frequently Asked Questions
What transceiver form factors is the SRQ-HJ-07 designed for?
The SRQ-HJ-07 is engineered for high-power optical transceiver form factors including QSFP-DD, OSFP, and CFP series modules. Its contact geometry and mounting configuration align with standard cage assembly dimensions used in 400G and 800G networking platforms.
Does the SRQ-HJ-07 support passive cooling without forced airflow?
The SRQ-HJ-07 can operate in passive cooling configurations for lower TDP modules, but its primary design target is forced-air environments. For passive-only deployments, thermal validation against your specific module TDP and ambient conditions is strongly recommended before production deployment.
What surface treatment does the SRQ-HJ-07 use and why does it matter?
The SRQ-HJ-07 uses an anodized surface finish, which increases surface emissivity for improved radiative heat transfer and provides corrosion resistance for long-term reliability. Anodizing also creates a hard, electrically insulating layer that prevents galvanic corrosion when in contact with dissimilar metals in the chassis.
SRQ-HJ-07 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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