Industrial / Heat Sinks
SRQ-HJ-16
The SRQ-HJ-16 (SRQ-HJ-16) is a high-performance industrial heat sink designed to handle elevated thermal loads from power transistors, thyristors, and solid-state relays. The wide-base fin design ensures uniform heat spreading and efficient convective cooling, reducing hotspot formation in densely packed assemblies. Suitable for industrial automation, motor drives, and UPS systems, the SRQ-HJ-16 meets RoHS compliance requirements for environmentally responsible manufacturing.
Key Features
- High-performance design handles elevated thermal loads from power-dense components
- Deep fin channels increase turbulent airflow for enhanced forced convection performance
- Heavy-duty base construction supports large-footprint power module packages
- Black anodized finish maximizes radiative heat dissipation in passive applications
- Drilled and tapped mounting holes for secure mechanical attachment of power devices
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-16 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling high-power IGBT and SiC MOSFET modules
Thermal management of three-phase inverter power stages
Heat dissipation for industrial welding machine power electronics
Cooling of high-current motor soft-starter assemblies
Thermal control in large-format industrial UPS systems
Frequently Asked Questions
What power dissipation levels can the SRQ-HJ-16 handle?
The SRQ-HJ-16 is designed for high-power applications where component dissipation may exceed 50 W. Actual capacity depends on airflow velocity, ambient temperature, and thermal interface quality. Refer to the thermal resistance curves in the datasheet for accurate power budget calculations.
Is the SRQ-HJ-16 suitable for SiC and GaN power devices?
Yes. Wide-bandgap devices like SiC MOSFETs and GaN transistors often operate at higher junction temperatures and switching frequencies, generating concentrated heat flux. The SRQ-HJ-16's robust base and high fin density make it well-suited for managing the thermal demands of these next-generation power semiconductors.
Does the SRQ-HJ-16 support liquid cooling integration?
The SRQ-HJ-16 is primarily an air-cooled heat sink. For applications requiring liquid cooling, CZT offers separate cold plate and liquid-cooled heat sink products. However, the SRQ-HJ-16 base can be used as a mounting platform with an external cold plate attached if thermal interface area is sufficient.
SRQ-HJ-16 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.