Industrial / Heat Sinks
SRQ-SLB-04
The SRQ-SLB-04 heat sink is built for medium-power thermal management, with a fin geometry that maximizes surface area within a compact footprint. The aluminum body supports direct mounting to transistors, MOSFETs, and voltage regulators. Frequently specified in switching power supplies, battery management systems, and servo amplifiers.
Key Features
- Fin geometry engineered to maximize surface area for medium-power loads
- Balanced thermal resistance suitable for 5–20W dissipation range
- Extruded aluminum construction with consistent fin pitch and height
- Multiple mounting hole options accommodate various device package layouts
- Compatible with natural convection and low-velocity forced-air cooling
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-04 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Medium-power linear regulator and power module cooling
Industrial automation relay driver thermal management
Mid-range inverter power stage heat dissipation
Battery management system MOSFET cooling
LED driver and lighting control board thermal control
Frequently Asked Questions
What power dissipation range is the SRQ-SLB-04 designed for?
The SRQ-SLB-04 is optimized for medium-power applications, typically in the 5–20W dissipation range under natural convection. Actual capacity varies with ambient temperature, mounting orientation, and whether forced airflow is present. Thermal simulation is recommended for boundary conditions.
How does the fin geometry of the SRQ-SLB-04 improve performance?
The fin geometry is designed to maximize the ratio of surface area to material volume, reducing thermal resistance while keeping weight and cost low. The fin pitch is selected to balance convective airflow through the channels against the total exposed surface area.
Can multiple devices be mounted on the SRQ-SLB-04 simultaneously?
Yes, the SRQ-SLB-04 base plate can accommodate multiple devices if their combined footprint fits within the base dimensions. However, total power dissipation must remain within the heat sink's rated capacity, and thermal spreading resistance should be accounted for in the design.
SRQ-SLB-04 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.