Industrial / Heat Sinks
SRQ-SLB-06-1
The SRQ-SLB-06-1 heat sink provides targeted cooling for single or dual power devices with a symmetrical fin layout that promotes uniform heat spreading. The anodized aluminum construction resists oxidation in industrial settings. Commonly applied in variable frequency drives, welding equipment, and power conditioning units.
Key Features
- Symmetrical fin layout provides uniform cooling for single or dual power devices
- Targeted thermal design minimizes heat spreading resistance to mounted components
- Compact footprint suitable for space-limited industrial PCB assemblies
- Anodized aluminum construction resists oxidation in humid environments
- Pre-tapped or clearance holes support standard device package mounting
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-06-1 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Dual MOSFET or IGBT half-bridge cooling
Single-phase inverter power device thermal management
Industrial power relay driver heat dissipation
Dual linear regulator thermal control on PCB
Point-of-load converter power stage cooling
Frequently Asked Questions
How many devices can be mounted on the SRQ-SLB-06-1?
The SRQ-SLB-06-1 is designed to accommodate one or two power devices. Its symmetrical fin layout ensures that heat from both mounting positions is dissipated evenly, preventing thermal imbalance between devices sharing the same heat sink base.
What is the advantage of a symmetrical fin layout?
A symmetrical fin layout ensures that airflow and heat dissipation are balanced across the entire heat sink surface. This is particularly important when two devices are mounted, as it prevents one device from running hotter than the other due to uneven thermal spreading.
How does the SRQ-SLB-06-1 differ from the SRQ-SLB-06-2?
The SRQ-SLB-06-1 and SRQ-SLB-06-2 share the same fin geometry but differ in mounting configuration. The 06-2 variant offers a modified hole pattern or base geometry to accommodate different device layouts or enclosure constraints within the same product family.
SRQ-SLB-06-1 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.