Industrial / Heat Sinks
SRQ-XJ-11
The SRQ-XJ-11 is a lightweight aluminum heat sink optimized for passive cooling of low-to-medium power dissipation components in cost-sensitive industrial designs. Its straightforward mounting interface reduces assembly time and ensures repeatable thermal contact. Typical use cases include signal conditioning modules, sensor electronics, and small form-factor power supplies.
Key Features
- Lightweight aluminum construction minimizes added mass on weight-sensitive PCB assemblies
- Optimized for passive cooling of components dissipating low-to-medium power levels
- Compact fin profile fits within tight board-level vertical clearance constraints
- Cost-effective thermal solution for high-volume consumer and industrial electronics
- Easy clip or adhesive mounting options reduce assembly time and tooling requirements
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-11 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Low-dropout regulator cooling in embedded system power rails
Small signal MOSFET thermal management in battery management systems
Passive cooling of gate driver ICs in compact inverter designs
Thermal relief for medium-power linear regulators in instrumentation
Cooling of power management ICs in IoT gateway hardware
Frequently Asked Questions
What power dissipation range is the SRQ-XJ-11 designed for?
The SRQ-XJ-11 targets components dissipating approximately 1–10W under natural convection conditions. Exact capacity depends on ambient temperature and mounting orientation. It is not recommended for high-power switching devices operating at continuous full load without supplemental airflow.
Can the SRQ-XJ-11 be attached using thermal adhesive tape?
Yes. The flat base surface is compatible with double-sided thermal adhesive tape for tool-free attachment in low-vibration environments. For applications subject to mechanical shock or vibration, mechanical fastening is preferred to ensure long-term retention.
Is the SRQ-XJ-11 available in custom lengths for specific board layouts?
CZT offers custom cut-to-length options for the SRQ-XJ-11 extrusion profile to accommodate specific PCB footprint requirements. Minimum order quantities apply for custom lengths. Contact CZT's sales team for tooling and lead time details.
SRQ-XJ-11 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.