Industrial / Heat Sinks
SRQ-XJ-24
The SRQ-XJ-24 heat sink provides reliable passive cooling for power transistors, IGBTs, and similar high-dissipation devices. Its parallel fin design promotes consistent airflow and uniform temperature distribution across the base plate. Commonly deployed in servo drives, UPS systems, and industrial automation equipment.
Key Features
- Reliable passive cooling for power transistors, IGBTs, and high-dissipation devices
- Flat lapped mounting surface minimizes thermal interface resistance to device case
- Extruded aluminum profile provides high strength-to-weight ratio for panel mounting
- Pre-drilled mounting holes compatible with standard IGBT and transistor footprints
- Suitable for continuous-duty operation in industrial power conversion equipment
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-24 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
IGBT module cooling in industrial inverter and drive systems
Power transistor heat dissipation in switching power supplies
Passive cooling for high-side and low-side switch assemblies
Heat sinking for power devices in motor soft-starter units
Thermal management in industrial UPS rectifier stages
Frequently Asked Questions
Is the SRQ-XJ-24 specifically designed for IGBT packages?
The SRQ-XJ-24 is designed to accommodate IGBTs, power transistors, and similar high-dissipation discrete devices. Mounting hole patterns and surface dimensions are compatible with common IGBT package footprints. Custom hole patterns are available for OEM applications with non-standard device layouts.
How important is surface flatness on the SRQ-XJ-24 mounting base?
Surface flatness is critical. Even small gaps between the device case and heat sink surface dramatically increase contact thermal resistance. The SRQ-XJ-24 features a precision-machined mounting surface to ensure consistent, low-resistance thermal contact. Always apply appropriate thermal interface material to fill any residual micro-gaps.
Can the SRQ-XJ-24 be used without a fan in a sealed enclosure?
Yes, for applications where power dissipation is within the passive thermal budget. In sealed enclosures, heat must ultimately transfer through the enclosure walls, so enclosure thermal resistance must be included in the overall thermal analysis. CZT recommends a full system-level thermal model for sealed passive deployments.
SRQ-XJ-24 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.