Industrial / Heat Sinks
SRQ-XJ-19
The SRQ-XJ-19 heat sink offers efficient thermal management for semiconductor devices and power modules in demanding industrial environments. Its fin array geometry maximizes surface area to improve natural convection airflow. Suitable for inverters, rectifiers, and embedded computing systems requiring stable operating temperatures.
Key Features
- Efficient thermal management optimized for semiconductor devices and power modules
- Low thermal resistance profile supports high-density power component layouts
- Extruded aluminum construction allows custom length cutting for OEM integration
- Uniform fin pitch balances airflow impedance and heat transfer surface area
- Suitable for vertical or horizontal mounting orientations in industrial enclosures
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-19 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Power module cooling in industrial drives and converters
Semiconductor device thermal management in automation controllers
Cooling for IGBT modules in traction and energy systems
Heat dissipation in industrial laser power supplies
Thermal management for high-power LED driver assemblies
Frequently Asked Questions
Can the SRQ-XJ-19 be cut to custom lengths for OEM applications?
Yes. As an extruded aluminum profile, the SRQ-XJ-19 can be supplied in custom lengths to suit specific enclosure or PCB layout requirements. CZT offers cut-to-length services for OEM and volume orders. Contact our sales team with your dimensional specifications.
How should mounting orientation be considered when installing the SRQ-XJ-19?
For natural convection, vertical fin orientation is strongly preferred as it aligns with buoyancy-driven airflow, reducing thermal resistance by 15–25% compared to horizontal fin mounting. In forced-air applications, orient fins parallel to the airflow direction for optimal performance.
What is the recommended torque for mounting power modules to the SRQ-XJ-19?
Mounting torque depends on the specific fastener size and device package. Typically, M3 screws are torqued to 0.5–0.8 N·m and M4 screws to 1.2–1.5 N·m. Always follow the semiconductor manufacturer's mounting guidelines to avoid cracking the device package or distorting the heat sink surface.
SRQ-XJ-19 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.