Industrial / Heat Sinks
SRQ-SLB-11-1
The SRQ-SLB-11-1 heat sink is part of the SRQ-SLB-11 series, offering a standard mounting configuration for broad compatibility with common power device packages. The extruded aluminum body provides reliable passive thermal management in continuous-duty applications. Frequently used in SMPS designs, industrial sensors, and embedded power systems.
Key Features
- Standard mounting configuration ensures broad compatibility across common PCB layouts
- Part of the SRQ-SLB-11 series with shared fin geometry for consistent thermal performance
- Extruded aluminum body with flat lapped base for low contact thermal resistance
- Mounting holes positioned for direct bolt-down to TO-package power semiconductors
- Suitable for both natural convection and low-velocity forced-air cooling setups
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-11-1 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Industrial control board power regulation with standard component footprints
IGBT and MOSFET cooling in mid-range power converters
Automation equipment output driver thermal management
Telecom rectifier modules requiring reliable passive heatsinking
Test and measurement instrument internal power stage cooling
Frequently Asked Questions
What distinguishes the SRQ-SLB-11-1 from the SRQ-SLB-11-2 variant?
The SRQ-SLB-11-1 uses a standard mounting hole pattern suited for the most common TO-package footprints, while the SRQ-SLB-11-2 is adapted for devices with different tab geometries or offset mounting requirements. Both share the same fin array and thermal profile — selection depends on your device's mechanical footprint.
Is the SRQ-SLB-11-1 compatible with electrically isolated mounting hardware?
Yes. The flat base accepts standard mica or ceramic isolation pads along with insulating shoulder bushings for electrically isolated mounting. This is essential when multiple devices at different potentials share a single heatsink. Ensure isolation kit thermal resistance is factored into your junction temperature calculations.
What is the recommended torque for mounting screws on the SRQ-SLB-11-1?
Mounting torque depends on screw size and whether an isolation pad is used. Typically M3 screws are torqued to 0.4–0.6 Nm and M4 screws to 0.8–1.2 Nm for TO-package devices. Over-torquing can crack isolation pads or deform the device tab, increasing contact resistance.
SRQ-SLB-11-1 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.