Industrial / Heat Sinks
SRQ-XJ-08
The SRQ-XJ-08 heat sink is engineered for board-level thermal management of MOSFETs, IGBTs, and similar switching devices in industrial power electronics. Its low-profile design allows integration into assemblies with limited vertical clearance. Common applications include inverter stages, DC-DC converters, and motor control boards.
Key Features
- Optimized fin pitch and height for MOSFET and IGBT board-level thermal management
- Low-profile design minimizes vertical clearance requirements on dense PCBs
- High-conductivity aluminum alloy base reduces spreading resistance under switching devices
- Clip or screw mounting options available for flexible assembly integration
- Suitable for natural convection and moderate forced-air cooling environments
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-08 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
IGBT gate driver board thermal management in servo drives
Synchronous rectifier MOSFET cooling in switching power supplies
H-bridge power stage heat dissipation in robotics controllers
PFC stage switching device cooling in industrial UPS systems
Board-mounted power module thermal interface in PLC hardware
Frequently Asked Questions
What is the recommended mounting method for IGBTs on the SRQ-XJ-08?
The SRQ-XJ-08 supports both clip-mount and screw-mount configurations. For IGBTs in TO-247 or TO-264 packages, screw mounting with an M3 fastener and controlled torque is recommended to ensure consistent contact pressure and repeatable thermal resistance.
How does the SRQ-XJ-08 perform in high-frequency switching applications?
The heat sink base material and fin geometry are well-suited for the continuous, high-frequency thermal cycling typical of MOSFET and IGBT switching applications. The aluminum alloy construction maintains dimensional stability across repeated thermal cycles.
Is the SRQ-XJ-08 compatible with conformal coating processes?
Yes. The anodized aluminum surface is chemically resistant to most conformal coating materials including acrylic and silicone-based compounds. Masking the mounting interface surface is advised to preserve thermal contact quality.
SRQ-XJ-08 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.