Industrial / Heat Sinks
SRQ-SLB-01
The SRQ-SLB-01 is an industrial-grade heat sink designed for efficient thermal dissipation in high-density electronic assemblies. Its extruded aluminum construction provides a reliable balance between weight and thermal conductivity. Commonly used in power supplies, motor drives, and industrial control panels where consistent component cooling is critical.
Key Features
- High-density fin array maximizes surface area for superior passive cooling
- Industrial-grade aluminum extrusion withstands harsh operating environments
- Optimized fin pitch balances airflow resistance and heat dissipation
- Flat lapped base ensures low thermal interface resistance with components
- Suitable for multi-device mounting across a shared thermal base
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-01 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-density power converter and inverter assemblies
Industrial control panel thermal management
Multi-device PCB power stage cooling
Telecom rectifier and DC-DC converter heat dissipation
Servo drive and motion control electronics cooling
Frequently Asked Questions
What makes the SRQ-SLB-01 suitable for high-density assemblies?
Its high-density fin array provides a large effective surface area within a compact footprint, allowing it to dissipate significant heat loads even when multiple power devices are mounted in close proximity. This makes it well-suited for densely populated power electronics boards.
What material is the SRQ-SLB-01 constructed from?
The SRQ-SLB-01 is manufactured from industrial-grade aluminum alloy using an extrusion process. Aluminum offers an excellent strength-to-weight ratio and thermal conductivity, and the anodized finish improves both corrosion resistance and radiative heat dissipation.
How should the SRQ-SLB-01 be oriented for best thermal performance?
For natural convection, fins should be oriented vertically to allow chimney-effect airflow between them. Horizontal fin orientation significantly reduces convective efficiency. In forced-air setups, align airflow parallel to the fin channels to minimize pressure drop.
SRQ-SLB-01 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.