Industrial / Heat Sinks
SRQ-HJ-19
The SRQ-HJ-19 (SRQ-HJ-19) is an industrial heat sink featuring a wide-base platform designed to accommodate multiple power devices in a single thermal assembly. This multi-device mounting capability reduces component count and simplifies thermal interface management in high-density power stages. The SRQ-HJ-19 is well suited for multi-axis servo drives, industrial robotics controllers, and high-current switching power supplies.
Key Features
- Wide-base platform accommodates multiple power devices in a single thermal assembly
- Uniform base thickness ensures consistent heat spreading across multi-device layouts
- High fin count maximizes total surface area for multi-source thermal loads
- Mounting provisions for TO-247, TO-264, and module-style power packages
- Suitable for parallel and series power device configurations in converter topologies
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-19 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Shared thermal management for multi-switch inverter legs
Cooling multiple rectifier diodes in three-phase bridge assemblies
Heat dissipation for paralleled MOSFET arrays in high-current converters
Thermal management of multi-device soft-starter power stages
Cooling of redundant power module configurations in critical systems
Frequently Asked Questions
How many power devices can be mounted on the SRQ-HJ-19 simultaneously?
The SRQ-HJ-19's wide-base platform is designed to accommodate multiple power devices, typically three to six TO-247 or similar packages depending on device footprint and required spacing. Verify total dissipation against the heat sink's thermal capacity and ensure adequate spacing between devices to prevent localized hot spots.
Does mounting multiple devices on the SRQ-HJ-19 affect thermal performance per device?
Yes. When multiple devices share a single heat sink, the total thermal load increases and the effective thermal resistance per device rises. Thermal simulation or calculation using superposition methods is recommended to verify that each device's junction temperature remains within its rated maximum under worst-case simultaneous loading.
Is electrical isolation required between devices mounted on the SRQ-HJ-19?
If devices at different potentials are mounted on the same heat sink, electrical isolation is mandatory. Use insulating pads such as mica, ceramic, or polymer thermal interface materials between each device and the heat sink base. Verify isolation voltage ratings match your system's requirements.
SRQ-HJ-19 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.