Industrial / Heat Sinks
SRQ-HJ-17
The SRQ-HJ-17 (SRQ-HJ-17) is an industrial heat sink optimized for thermal management of surface-mount and through-hole power devices in PCB-level assemblies. Its low-profile fin array minimizes board height while providing adequate heat dissipation for switching regulators and gate driver ICs. The SRQ-HJ-17 is a practical solution for industrial IoT gateways, programmable logic controllers, and compact embedded systems requiring passive cooling.
Key Features
- Optimized for thermal management of both SMD and through-hole power components
- Low-profile fin array accommodates mixed-technology PCB assembly constraints
- Precision base machining ensures consistent contact with flat-pack power packages
- Clip-mount and adhesive-mount options simplify SMT-compatible assembly processes
- Thermally efficient design reduces PCB copper pour requirements for heat spreading
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-17 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling SMD power MOSFETs in switching regulator designs
Thermal management of D2PAK and DPAK packaged devices
Heat dissipation for through-hole power transistors on mixed PCBs
Cooling of SMD bridge rectifiers in compact power supplies
Thermal control of power ICs in industrial IoT gateway boards
Frequently Asked Questions
How is the SRQ-HJ-17 attached to SMD power packages?
For SMD packages such as D2PAK, the SRQ-HJ-17 can be attached using thermally conductive adhesive film or spring clips designed for surface-mount devices. Adhesive mounting is common in automated assembly lines, while clip mounting is preferred where the heat sink may need to be replaced during field servicing.
Does the SRQ-HJ-17 interfere with adjacent SMD components?
The SRQ-HJ-17 is designed with a compact footprint to minimize interference with neighboring components. Always verify clearance against your PCB layout, particularly for tall electrolytic capacitors or connectors adjacent to the power device. 3D CAD models are available from CZT for layout verification.
Is the SRQ-HJ-17 compatible with reflow soldering processes?
The SRQ-HJ-17 itself is not soldered to the PCB. It is applied after reflow soldering of the power device. Thermally conductive adhesive variants can be applied post-reflow in a separate assembly step, maintaining compatibility with standard SMT production workflows.
SRQ-HJ-17 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.