Industrial / Electroplating
SFP连接器端子 SFP Connector Terminal Plating
Model:SFP连接器端子
The SFP Series (SFP连接器端子) is a precision-plated SFP connector terminal component with gold plating applied without haze, spots, burn marks, or exposed copper, and tin plating free of surface defects, meeting strict appearance and bonding strength standards for SFP transceiver contact applications. The bonding strength is validated by a 90-degree bend test and 3 mm tape peel test on the smooth contact surface, ensuring the plating layer withstands the mechanical stresses of repeated SFP module insertion and extraction. These terminals are used in SFP cage assemblies for 1G and 10G optical networking equipment in enterprise and carrier environments.
Key Features
- Precision gold plating free of haze, spots, burn marks, and exposed copper
- Zero color difference tolerance enforced across entire production batch
- Nickel undercoat provides diffusion barrier and enhances plating adhesion
- Tin plating zones applied without haze or surface scratches
- Meets stringent SFP connector terminal appearance and dimensional standards
Key Specifications
- Service type: connector terminal electroplating / selective plating
- Connector family: SFP
- Plating focus: gold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
- Quality focus: appearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
- +11 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP Connector Terminal Plating Specifications
Service typeconnector terminal electroplating / selective plating
Connector familySFP
Plating focusgold, nickel, tin, or selective plating stack per customer drawing and RFQ requirements
Quality focusappearance, adhesion, bending performance, contact zone consistency, and batch color control where applicable
Drawing statusRequest Drawing or plating specification during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm substrate material, plating stack, thickness, contact area, reel / barrel / rack process, masking requirements, test method, and inspection criteria
1. AppearanceA、gold plating without haze、spots、black spots、burn marks、scratches、exposed Cu、plating skip；
B、色差no color difference allowed in same batch；
C、色泽no plating discoloration；
D、tin plating without haze、spots、scratches现象；
E、after plating,, Flat Pinno deformation；
2. Bonding Strengthtake a set of flat pins,bend toward smooth side90°restore after bending,every interval of2mmrepeat this bending action,再using3mmtape peel test on smooth side
(gold plating面)orat10x magnification inspection, no plating peeling is acceptable；
3. Flexibilityfrom smooth side to burr side of flat pin90°reciprocating bending2次, no break is acceptable；
Typical Applications
Standard SFP connector terminal contact assemblies
Optical transceiver modules for telecom and datacom
High-density switch backplane SFP interface connectors
Automated SMT connector assembly lines requiring consistent finish
SFP cage assemblies in enterprise networking hardware
Frequently Asked Questions
What appearance defects are explicitly rejected during inspection?
Rejected defects include gold plating haze, spots, black spots, burn marks, scratches, exposed copper, and plating skip. Tin-plated areas are inspected for haze and scratches. No color difference is permitted within the same batch, and plating discoloration is a cause for rejection.
Is a nickel undercoat applied beneath the gold plating?
Yes, a nickel barrier layer is applied prior to gold plating. The nickel undercoat prevents copper diffusion into the gold layer, which would degrade contact resistance over time and cause discoloration. Nickel thickness is controlled to specification as part of the standard plating process.
Can plating specifications be customized for specific SFP connector designs?
Yes, gold thickness, nickel thickness, and selective plating zone definitions can be adjusted to meet customer-specific requirements. CZT supports customer-supplied plating drawings and can provide plating cross-section reports and XRF thickness measurement data for qualification.
SFP Connector Terminal Plating Details
CategoryIndustrial
SubcategoryElectroplating
Model NumberSFP连接器端子
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.