Industrial / Precision Die Casting
SFP+Structural Part 11
Die-cast SFP+ structural component offering precise dimensional control and robust mechanical properties for small form-factor transceiver applications. The part is designed to integrate seamlessly into SFP+ module housings, providing structural rigidity and EMI containment. Typical use cases include 10G fiber-optic transceivers, industrial Ethernet switches, and data center interconnect hardware.
Key Features
- Precise dimensional control ensures consistent SFP+ cage and PCB fitment
- Robust mechanical properties support high mating cycle durability
- Die-cast construction eliminates weld lines and porosity for structural integrity
- Optimized draft angles and parting lines for clean surface finish
- Scalable production process supports both prototype and mass volume orders
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: SFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP+Structural Part 11 Specifications
Product typeprecision die-cast structural component
Connector / hardware familySFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
SFP+ module housing for data center switching equipment
Telecom access network optical transceiver assemblies
10GbE SFP+ active copper cable connector housings
Storage area network (SAN) HBA transceiver frames
Military and industrial-grade SFP+ module enclosures
Frequently Asked Questions
What surface roughness can be achieved on die-cast SFP+ structural parts?
CZT's precision die casting process achieves surface roughness of Ra 1.6–3.2 μm on as-cast surfaces. For mating or sealing surfaces requiring finer finish, secondary machining or polishing can achieve Ra 0.8 μm or better, depending on the functional requirements of the assembly.
How are porosity and internal defects controlled in the die casting process?
CZT uses vacuum-assisted die casting and optimized gate/runner design to minimize gas entrapment and shrinkage porosity. Critical parts are subject to X-ray or dye-penetrant inspection to detect internal defects before shipment, ensuring structural integrity in demanding transceiver applications.
Can CZT provide PPAP or first-article inspection documentation?
Yes. CZT supports PPAP (Production Part Approval Process) documentation including dimensional reports, material certifications, and process capability studies. First-article inspection (FAI) reports are standard for new part numbers and are provided before mass production approval.
SFP+Structural Part 11 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.