Industrial / Precision Die Casting
SFP+Structural Part 15
SFP+ structural part manufactured via precision die casting to provide reliable mechanical support and EMI shielding within small form-factor pluggable transceiver modules. Consistent casting quality ensures repeatable fitment and long service life under demanding operating conditions. Used in 10G SFP+ transceivers across data center, telecom access, and industrial Ethernet applications.
Key Features
- Precision die casting provides reliable mechanical support for SFP+ module internals
- Integrated EMI shielding structure reduces radiated emissions in transceiver assemblies
- Consistent dimensional output supports high-volume automated module assembly
- Alloy composition selected for optimal thermal conductivity and mechanical strength
- Designed to comply with SFP+ MSA mechanical and environmental specifications
Key Specifications
- Product type: precision die-cast structural component
- Connector / hardware family: SFP
- Process: precision die casting with secondary machining or finishing as required by drawing
- Application focus: connector housing, cage, shell, heatsink carrier, or industrial structural part
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SFP+Structural Part 15 Specifications
Product typeprecision die-cast structural component
Connector / hardware familySFP
Processprecision die casting with secondary machining or finishing as required by drawing
Application focusconnector housing, cage, shell, heatsink carrier, or industrial structural part
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm alloy, dimensional tolerance, tooling status, surface finish, machining operations, inspection criteria, and drawing revision
Typical Applications
SFP+ transceiver module EMI shielding and structural housing
High-density optical interconnect module frame production
5G fronthaul and midhaul SFP+ interface module assemblies
Cloud networking 25G SFP28-compatible transceiver housings
Railway and transportation SFP+ module structural enclosures
Frequently Asked Questions
How does the die-cast housing contribute to EMI shielding in SFP+ transceivers?
The conductive metal die-cast housing forms a Faraday cage around the transceiver's high-speed electrical circuitry, attenuating radiated emissions and providing immunity to external interference. CZT can optimize wall thickness, seam design, and surface conductivity to meet specific EMI shielding effectiveness targets.
What thermal performance can be expected from the die-cast SFP+ structural part?
Aluminum alloy die-cast parts offer thermal conductivity of approximately 96–130 W/m·K, enabling effective heat spreading from the transceiver's laser and driver IC to the host cage. This is critical for maintaining junction temperatures within spec in high-power SFP+ and SFP28 applications.
Does CZT offer design-for-manufacturability (DFM) support for custom SFP+ structural parts?
Yes. CZT's engineering team provides DFM review for customer-supplied designs, identifying features that may cause casting defects, excessive tooling wear, or dimensional variation. Recommendations cover draft angles, wall thickness uniformity, gate placement, and ejector pin locations to optimize yield and part quality.
SFP+Structural Part 15 Details
CategoryIndustrial
SubcategoryPrecision Die Casting
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.