Industrial / Heat Sinks
SRQ-YZ-20
The SRQ-YZ-20 heat sink provides reliable passive thermal management for semiconductor devices and power components in industrial environments. Constructed for durability under continuous operating conditions, it helps maintain component temperatures within safe limits. Commonly used in inverters, voltage regulators, and industrial automation equipment.
Key Features
- Passive thermal management eliminates fan noise and maintenance requirements
- Optimized base-to-fin thermal path minimizes junction-to-ambient resistance
- Suitable for TO-220, TO-247, and D2PAK semiconductor package mounting
- Aluminum extrusion construction offers high strength-to-weight ratio
- Consistent fin geometry ensures predictable thermal performance across production batches
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-20 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Passive cooling of power MOSFETs in industrial switching power supplies
Heat dissipation for diode bridges in industrial battery management systems
Thermal management of voltage regulators in programmable logic controllers
Cooling power components in industrial sensor interface modules
Heat sinking for transistors in industrial lighting control systems
Frequently Asked Questions
Which semiconductor package types are compatible with the SRQ-YZ-20?
The SRQ-YZ-20 is compatible with common through-hole and surface-mount power packages including TO-220, TO-247, TO-3P, and D2PAK. For module-style packages, verify base dimensions and mounting hole pitch against the heat sink's specifications before ordering.
How do I calculate whether the SRQ-YZ-20 is sufficient for my application?
Use the formula: Rth(s-a) ≤ (Tj_max - Ta) / P - Rth(j-c) - Rth(c-s). Obtain Tj_max and Rth(j-c) from your device datasheet, estimate Rth(c-s) based on your thermal interface material, and compare the required Rth(s-a) against the SRQ-YZ-20's rated value.
Does the SRQ-YZ-20 require any special installation considerations?
Ensure the mounting surface is clean and flat before installation. Apply thermal interface material uniformly and torque mounting screws to the recommended value to avoid uneven contact pressure. Avoid over-tightening, which can bow the device package and increase contact thermal resistance.
SRQ-YZ-20 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.