Industrial / Heat Sinks
SRQ-YZ-21
The SRQ-YZ-21 is a passive heat sink engineered to improve thermal performance in densely packed electronic assemblies. Its fin structure promotes natural convection airflow, reducing the need for active cooling solutions. Well-suited for use in LED drivers, switching power supplies, and control board applications.
Key Features
- Engineered for dense PCB assemblies where board space is at a premium
- Low-profile fin array maintains airflow clearance in tightly packed enclosures
- Optimized thermal spreading base reduces hotspot formation under component footprint
- Lightweight design minimizes additional mechanical load on PCB solder joints
- Compatible with clip and screw mounting for flexible assembly integration
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-21 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Thermal management in high-density industrial embedded computing boards
Cooling power ICs in compact multi-axis motion controller assemblies
Heat dissipation for FPGAs and DSPs in industrial signal processing units
Passive cooling in densely populated industrial IoT gateway hardware
Thermal management for power stages in miniaturized industrial inverters
Frequently Asked Questions
How does the SRQ-YZ-21 address thermal hotspots in dense assemblies?
The SRQ-YZ-21 features an optimized base thickness that promotes lateral heat spreading before transfer to the fins. This reduces peak hotspot temperatures under the component footprint, improving junction temperature uniformity and extending device reliability in densely packed board layouts.
What is the minimum clearance required around the SRQ-YZ-21 for effective natural convection?
For effective natural convection, maintain at least 10–15mm of clearance above the fin tips and 5mm on fin-end sides to allow chimney airflow. In tightly packed assemblies where clearance is limited, consider supplemental forced airflow to compensate for restricted convection paths.
Can the SRQ-YZ-21 be used with clip-mount attachment to avoid PCB drilling?
Yes. The SRQ-YZ-21 supports spring-clip mounting, which secures the heat sink to the component without requiring PCB holes. This simplifies assembly and allows rework. Ensure the clip provides adequate clamping force to maintain consistent thermal interface contact under vibration.
SRQ-YZ-21 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.