Industrial / Heat Sinks
SRQ-YZ-24
The SRQ-YZ-24 heat sink delivers stable passive cooling for transistors, MOSFETs, and other heat-generating devices in industrial electronics. The design balances thermal resistance with a low-profile footprint, making it adaptable to various mounting configurations. Suitable for use in battery management systems, DC-DC converters, and industrial control panels.
Key Features
- Stable passive cooling for transistors, MOSFETs, and linear regulators
- Low-profile fin array design suited for space-constrained enclosures
- Anodized aluminum body provides corrosion resistance and improved emissivity
- Consistent thermal performance across wide ambient temperature ranges
- Designed for direct component mounting with standard fastener patterns
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-YZ-24 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
MOSFET thermal management in DC-DC converter designs
Linear voltage regulator cooling in industrial control boards
Transistor arrays in audio amplifier and signal processing equipment
Passive cooling for gate driver ICs in motor controllers
Thermal dissipation in telecom power supply modules
Frequently Asked Questions
Which component packages are compatible with the SRQ-YZ-24?
The SRQ-YZ-24 is compatible with standard power packages including TO-220, TO-263, and D2PAK footprints. Verify the mounting hole pattern and base dimensions against your component's tab or flange dimensions before installation.
Does the SRQ-YZ-24 require thermal interface material?
Yes, applying thermal interface material (TIM) such as thermal paste or a phase-change pad between the component and heat sink base is strongly recommended. This eliminates air gaps caused by surface irregularities and can reduce junction-to-case thermal resistance by 20–40%.
Can the SRQ-YZ-24 be used in sealed enclosures?
It can be used in sealed enclosures, but thermal performance will be reduced due to limited airflow. In sealed designs, ensure the enclosure itself has adequate surface area for heat dissipation, or consider forced convection to maintain component temperatures within safe limits.
SRQ-YZ-24 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.