Industrial / Heat Sinks
SRQ-CC-03 Heat Sink
Model:SRQ-CC-03
The SRQ-CC-03 is a compact heat sink designed for thermal management of optical transceiver modules and high-power ICs in space-constrained networking and industrial electronics applications. Its low-profile fin structure is optimized for natural convection or low-velocity forced-air cooling in enclosed equipment enclosures, making it suitable for edge computing nodes, industrial switches, and embedded networking platforms. The precision-machined base ensures optimal thermal contact with the heat-generating component, minimizing thermal interface resistance for effective heat transfer in compact form-factor networking and industrial equipment.
Key Features
- Compact low-profile design fits space-constrained optical module and IC applications
- High surface-area-to-volume ratio fin geometry maximizes heat dissipation efficiency
- Lightweight aluminum construction minimizes additional board-level mechanical load
- Compatible with standard thermal interface materials and adhesive mounting
- Suitable for both natural convection and low-velocity forced airflow environments
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-CC-03 Heat Sink Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Compact optical transceiver module thermal management on dense PCBs
High-power IC cooling in space-constrained embedded systems
Small form factor networking equipment thermal control
Optical module heat dissipation in portable test instruments
Edge computing node transceiver and processor thermal management
Frequently Asked Questions
What are the overall dimensions of the SRQ-CC-03?
The SRQ-CC-03 is a compact heat sink with dimensions optimized for small form factor applications. Exact dimensions are available in the CZT product datasheet. Custom sizing is available for OEM programs with specific height or footprint constraints.
Is the SRQ-CC-03 suitable for QSFP-DD or OSFP high-power module applications?
The SRQ-CC-03 is designed for moderate power dissipation in compact form factors. For very high-power modules such as QSFP-DD 800G or OSFP, the larger SRQ-CC-04 or SRQ-CC-05 variants may be more appropriate. CZT can assist with thermal modeling to select the right product.
What alloy grade is used and what is its thermal conductivity?
The SRQ-CC-03 is manufactured from aluminum alloy with thermal conductivity typically in the range of 150–200 W/m·K depending on alloy grade. CZT selects alloy grades that balance thermal performance, machinability, and anodizing quality for reliable long-term operation.
SRQ-CC-03 Heat Sink Details
CategoryIndustrial
SubcategoryHeat Sinks
Model NumberSRQ-CC-03
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.