Industrial / Heat Sinks
SRQ-CC-04 Heat Sink
Model:SRQ-CC-04
The SRQ-CC-04 is a high-performance heat sink engineered for demanding thermal management requirements in optical networking and high-speed connector applications. Featuring an extended fin array for maximum surface area, this heat sink is designed for active cooling environments where high-power optical modules, switch ASICs, or power electronics require aggressive heat dissipation. Its aluminum alloy construction and precision-machined mounting surface ensure reliable thermal contact and long-term performance stability in 24/7 data center and carrier network equipment operating at elevated power densities.
Key Features
- High-performance fin array engineered for demanding optical networking thermal loads
- Optimized airflow channel geometry reduces pressure drop while maximizing heat transfer
- Precision machined base ensures low thermal contact resistance with module surfaces
- Supports high-power dissipation requirements of 400G and 800G optical modules
- Robust construction rated for extended operation in harsh network environments
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-CC-04 Heat Sink Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
400G QSFP-DD and 800G OSFP optical module thermal management
High-density core router line card thermal dissipation
Hyperscale data center switch optical interface cooling
High-power coherent optical transceiver thermal control
5G fronthaul and midhaul optical networking equipment cooling
Frequently Asked Questions
What maximum power dissipation can the SRQ-CC-04 handle?
The SRQ-CC-04 is engineered for high-power optical networking applications. Maximum power dissipation depends on airflow velocity and inlet air temperature. CZT provides thermal resistance curves and maximum power ratings under defined airflow conditions in the product datasheet.
How is the SRQ-CC-04 retained on high-power optical modules?
The heat sink uses a spring-clip or screw-retention mechanism that maintains consistent contact pressure across the module surface, compensating for PCB flex and thermal expansion. Retention force is calibrated to meet module vendor contact pressure specifications without damaging the module housing.
Is the SRQ-CC-04 compatible with NEBS Level 3 environmental requirements?
The SRQ-CC-04 is designed with telecom-grade robustness in mind. For formal NEBS Level 3 compliance, system-level qualification testing is required. CZT can provide material certifications, thermal characterization data, and vibration test reports to support your system qualification process.
SRQ-CC-04 Heat Sink Details
CategoryIndustrial
SubcategoryHeat Sinks
Model NumberSRQ-CC-04
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.