Industrial / Heat Sinks
SRQ-CC-05 Heat Sink
Model:SRQ-CC-05
The SRQ-CC-05 is a precision heat sink designed for thermal management of SFP, SFP+, and QSFP transceiver modules in high-density networking equipment. Its fin geometry is optimized to balance thermal resistance and airflow impedance in forced-air-cooled switch and router chassis, ensuring that optical modules operate within their specified temperature range for maximum reliability and longevity. The heat sink's compact form factor and standardized mounting interface make it compatible with a wide range of transceiver cage designs used in enterprise and carrier networking platforms.
Key Features
- Precision heat sink supporting SFP, SFP+, and QSFP module form factors in one design
- Engineered for high-density port configurations with minimal inter-module thermal interference
- Optimized fin pitch balances thermal performance with airflow impedance in 1U chassis
- Anodized aluminum construction provides corrosion resistance in high-humidity environments
- Validated thermal performance across full industrial operating temperature range
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-CC-05 Heat Sink Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
SFP and SFP+ module cooling in 1U and 2U rack switches
QSFP28 transceiver thermal management in high-density aggregation switches
Multi-rate optical interface cooling in carrier-grade routers
High-density OTN transponder card transceiver thermal control
Campus and enterprise core switch optical port thermal management
Frequently Asked Questions
Can the SRQ-CC-05 accommodate both SFP and QSFP modules without modification?
The SRQ-CC-05 is designed to support multiple transceiver form factors. Compatibility with specific SFP, SFP+, and QSFP variants depends on module height and surface geometry. CZT recommends reviewing dimensional drawings against your specific module mix to confirm fit before procurement.
How does the SRQ-CC-05 perform in high-density 1U switch configurations?
The fin pitch and airflow channel geometry are optimized for the restricted airflow conditions typical of 1U chassis with front-to-rear cooling. Thermal performance data under representative airflow velocities is available from CZT to support system-level thermal budget analysis.
What is the expected service life of the SRQ-CC-05 in continuous operation?
Aluminum heat sinks have no inherent wear-out mechanism under normal operating conditions. Service life is primarily limited by the integrity of the thermal interface material and retention mechanism. CZT recommends periodic inspection of contact pressure and TIM condition in high-cycle maintenance environments.
SRQ-CC-05 Heat Sink Details
CategoryIndustrial
SubcategoryHeat Sinks
Model NumberSRQ-CC-05
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
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