Industrial / Heat Sinks
SRQ-HJ-02
The SRQ-HJ-02 is a high-performance heat sink engineered for thermal management of high-power optical modules and networking components in enterprise and carrier-grade equipment. Its advanced fin construction provides superior thermal performance compared to standard extruded heat sinks, making it suitable for QSFP-DD and OSFP modules operating at 400G and 800G data rates where power dissipation per module can exceed 15 W. The heat sink's precision-machined base and optimized fin array ensure reliable thermal management in high-density switch and router platforms used in hyperscale data centers.
Key Features
- Optimized fin geometry for maximum thermal dissipation in high-power optical modules
- Compatible with QSFP-DD, OSFP, and CFP2 transceiver form factors
- Low thermal resistance design ensures stable junction temperatures under sustained load
- Precision CNC-machined aluminum alloy construction for consistent contact surface flatness
- Supports thermal design power (TDP) up to 30W per module slot
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-02 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
400G/800G optical transceiver thermal management in data centers
High-density networking switch ASIC cooling solutions
Telecom line card thermal regulation in core routers
High-power SFP+ and QSFP28 module heat dissipation
Industrial Ethernet switch thermal management applications
Frequently Asked Questions
What optical module form factors is the SRQ-HJ-02 compatible with?
The SRQ-HJ-02 is engineered for compatibility with high-power optical module form factors including QSFP-DD, OSFP, and CFP2. Its contact surface geometry and mounting pattern are designed to match standard cage assembly footprints used in 400G and higher-speed networking equipment.
What is the maximum TDP this heat sink can handle?
The SRQ-HJ-02 is rated for thermal design power up to approximately 30W per module. Actual performance depends on airflow conditions, ambient temperature, and interface material used. We recommend validating thermal performance under your specific system airflow and operating conditions.
What material and surface finish does the SRQ-HJ-02 use?
The SRQ-HJ-02 is manufactured from high-conductivity aluminum alloy with a precision-machined contact surface to minimize interface thermal resistance. An anodized finish is applied for corrosion resistance and improved emissivity, extending service life in industrial environments.
SRQ-HJ-02 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.