Industrial / Heat Sinks
SRQ-HJ-08
The SRQ-HJ-08 is a precision heat sink designed for thermal management of high-power optical modules and networking ASICs in enterprise and carrier-grade equipment. Its advanced fin construction and optimized base thickness provide the thermal performance required for QSFP-DD and OSFP modules operating at 400G and 800G data rates, where power dissipation per module can exceed 15 W. The heat sink is designed for integration with standard transceiver cage assemblies in high-density switch and router platforms used in hyperscale data centers and 5G transport networks.
Key Features
- Precision heat sink optimized for high-power optical modules and networking ASICs
- High-density fin array maximizes convective surface area within constrained footprint
- Flat lapped base surface minimizes contact resistance with module lid or spreader
- Aluminum alloy construction balances thermal conductivity, weight, and machinability
- Mounting configuration compatible with standard ASIC and optical module PCB layouts
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-08 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Networking ASIC thermal management in high-density switch fabrics
High-power optical module cooling in 400G/800G line cards
Data center spine switch ASIC heat dissipation
Coherent DSP chip thermal regulation in optical transport equipment
High-power SoC cooling in carrier-grade networking hardware
Frequently Asked Questions
Is the SRQ-HJ-08 suitable for direct attachment to networking ASICs?
Yes. The SRQ-HJ-08's flat lapped base and standard mounting hole pattern make it suitable for direct attachment to networking ASICs and DSP chips. It is compatible with standard spring-clip and screw-down retention mechanisms used in PCB-level ASIC thermal solutions.
How does fin density affect the SRQ-HJ-08's performance in different airflow conditions?
Higher fin density increases heat transfer surface area but also raises airflow impedance. The SRQ-HJ-08's fin pitch is selected to optimize thermal resistance across the airflow velocities typical of chassis cooling fans, balancing dissipation capacity against pressure drop in high-density equipment.
What is the recommended thermal interface material for the SRQ-HJ-08?
For optimal performance, a high-conductivity thermal interface material with conductivity of 6 W/m·K or higher is recommended. Phase-change pads or high-performance thermal grease are both compatible with the SRQ-HJ-08's base surface. Avoid thick TIM layers, as they increase effective interface resistance.
SRQ-HJ-08 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.