Industrial / Heat Sinks
SRQ-XJ-12
The SRQ-XJ-12 heat sink is designed with closely spaced fins to maximize thermal surface area within a compact footprint, making it effective in forced-air cooling environments. The aluminum construction keeps weight low while maintaining structural rigidity under vibration. Suited for frequency inverters, industrial computers, and ruggedized control systems.
Key Features
- Closely spaced fin array maximizes thermal surface area within a compact PCB footprint
- High fin density increases convective heat transfer coefficient under natural and forced airflow
- Precision-extruded profile maintains consistent fin spacing for predictable thermal performance
- Compact base dimensions suit space-constrained power electronics designs
- Compatible with standard TO-220, TO-247, and D2PAK surface-mount packages
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-12 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Compact switching power supply MOSFET cooling with limited board space
Dense power module thermal management in rack-mount industrial equipment
High-density inverter board power device cooling in servo amplifiers
Space-constrained DC-DC converter synchronous rectifier thermal relief
Tight-pitch power component cooling in medical device power stages
Frequently Asked Questions
Does the high fin density of the SRQ-XJ-12 restrict airflow in natural convection?
Closely spaced fins can increase flow resistance in natural convection. The SRQ-XJ-12 fin pitch is selected to balance surface area and chimney effect airflow. For best natural convection performance, orient the fins vertically to maximize buoyancy-driven airflow through the channels.
How does the SRQ-XJ-12 compare to lower fin density alternatives in forced-air applications?
Under forced airflow, the SRQ-XJ-12's high fin density delivers significantly lower thermal resistance compared to wider-pitch designs of the same footprint. Performance gains are most pronounced at airflow velocities above 1 m/s, making it well-suited for fan-cooled enclosures.
What cleaning methods are safe for the SRQ-XJ-12 after PCB assembly?
The anodized aluminum surface withstands standard PCB cleaning agents including isopropyl alcohol and aqueous flux removers. Avoid strongly alkaline cleaners, which can attack the anodized layer. Ultrasonic cleaning is acceptable at standard frequencies and power levels.
SRQ-XJ-12 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.