Industrial / Heat Sinks
SRQ-XJ-13
The SRQ-XJ-13 is a channel-style heat sink that accommodates inline mounting of multiple discrete power components along a shared thermal base. This configuration simplifies wiring layouts and improves thermal uniformity across a power stage. Commonly found in three-phase rectifier bridges, thyristor assemblies, and industrial power distribution units.
Key Features
- Channel-style profile accommodates inline mounting of multiple discrete power components
- Continuous extrusion design allows cut-to-length customization for varying component counts
- Integrated mounting channel simplifies alignment and reduces assembly complexity
- Uniform thermal path along the channel length ensures consistent device junction temperatures
- Compatible with TO-220, TO-218, and similar axially arranged power packages
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-13 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Inline rectifier diode string cooling in multi-output power supplies
Series-mounted transistor array thermal management in linear amplifiers
Multiple TO-220 regulator cooling along a single PCB edge
Inline MOSFET bank heat dissipation in motor controller output stages
Daisy-chained power device cooling in industrial relay driver boards
Frequently Asked Questions
How many devices can be mounted inline on the SRQ-XJ-13?
The SRQ-XJ-13 channel accepts as many devices as the selected length permits, based on individual package widths and required isolation spacing. CZT supplies the profile in standard lengths and offers custom cut-to-length to match exact component counts and PCB layouts.
Does the channel design provide electrical isolation between mounted devices?
The aluminum channel is electrically conductive. Devices sharing the heat sink must either have isolated packages or use insulating pads between the device tab and the channel surface. Mica, silicone, or ceramic insulating pads with appropriate thermal conductivity are recommended.
Is the SRQ-XJ-13 suitable for chassis mounting as well as PCB mounting?
Yes. The channel profile includes mounting features compatible with both direct PCB attachment and chassis panel mounting. This flexibility makes it suitable for designs where the heat sink bridges the PCB and an enclosure wall for improved thermal dissipation.
SRQ-XJ-13 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.