Industrial / Heat Sinks
SRQ-XJ-14
The SRQ-XJ-14 heat sink features a tall fin profile that delivers enhanced thermal resistance reduction in applications where component power dissipation is elevated. Its extruded aluminum body is compatible with standard thermal interface materials for optimized heat transfer. Designed for use in high-power amplifiers, industrial laser drivers, and energy storage systems.
Key Features
- Tall fin profile delivers low thermal resistance for high-power dissipation applications
- Extended fin height maximizes convective surface area without increasing base footprint
- Suitable for natural convection and high-velocity forced-air cooling configurations
- Precision-extruded 6063 aluminum alloy ensures structural rigidity of tall fin array
- Mounting base compatible with standard TO-247, TO-264, and press-pak power packages
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-14 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-power IGBT cooling in industrial variable frequency drives
Forced-air cooled power amplifier output stage thermal management
High-dissipation linear power supply pass transistor cooling
Tall-fin passive cooling of power modules in telecom rectifiers
High-power thyristor heat dissipation in industrial soft starters
Frequently Asked Questions
What is the thermal resistance advantage of the SRQ-XJ-14's tall fin profile?
Taller fins increase total convective surface area proportionally, reducing thermal resistance compared to shorter profiles of the same base footprint. The SRQ-XJ-14 is particularly effective in forced-air applications where fin height directly translates to lower junction-to-ambient thermal resistance.
Are there mechanical stability concerns with the tall fin array under vibration?
The SRQ-XJ-14 is extruded as a single-piece profile, eliminating bonded fin joint failure risks. The 6063-T5 alloy provides adequate stiffness for typical industrial vibration environments. For high-shock applications, secure base mounting with multiple fasteners is recommended.
What airflow velocity is recommended to achieve rated thermal performance?
Optimal performance is achieved at airflow velocities between 2–5 m/s directed parallel to the fin channels. At these velocities, the tall fin geometry provides a significant reduction in thermal resistance compared to natural convection baseline values. Consult CZT's thermal characterization data for specific resistance curves.
SRQ-XJ-14 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.